40.15 SPI Mode Electrical Specifications

Figure 40-1. SPIx Host Module CPHA = 0 Timing Diagrams

Figure 40-2. SPIx Host Module CPHA = 1 Timing Diagrams

Table 40-18. SERCOM SPIx Module Host Mode Electrical Specifications⁽¹⁾
AC CHARACTERISTICS			Standard Operating Conditions: VDD and VDDIO 2.7V to 5.5V (unless otherwise stated) Operating temperature: -40°C ≤ TA ≤ +125°C for Extended Temp
Param. No.	Symbol	Characteristics⁽¹⁾	Min.	Typ.	Max.	Units	Conditions
MSP_1	FSCK	SCK Frequency	—	—	14.2	MHz	Transmitter mode, CTRLB.RXEN = 0, C_LOAD=30pF(max).
			—	—	4.63		Full Duplex Transmit and Receive mode, CLOAD = 30pF(max). Loop-Back mode with one SPI talking to another SPI on the same MCU.
			—	—	1/(2*(TMIS+NOTE2_TV))⁽²⁾		Full Duplex Transmit and Receive mode, C_LOAD=30pF(max). The maximum SPI speed of the MCU is partially dependent on the external SPI device performance characteristics. Faster speeds than the Loop- Back mode above may therefore be possible using the formula.
MSP_11	TMOV	MOSI Data Output Valid after SCK	—	—	24.6	ns	VDDIO(min), C_LOAD = 30 pF(max)
MSP_15	TMIS	MISO Setup Time of Data Input to SCK	51.7	—	—	ns	VDDIO(min), C_LOAD = 30 pF(max)
Note: Assumes VDDIO(min) and 30 pF external load on all SPIx pins unless otherwise noted. NOTE2_TV is the client external device data output valid time from clock edge specification.

Figure 40-3. SPIx Client Module CPHA = 0 Timing Diagram

Figure 40-4. SPIx Client Module CPHA = 1 Timing Diagram

Table 40-19. SERCOM SPIx Module Client Mode Electrical Specifications
AC CHARACTERISTICS			Standard Operating Conditions: VDD and VDDIO 2.7V to 5.5V (unless otherwise stated) Operating temperature: -40°C ≤ TA ≤ +125°C for Extended Temp
Param. No.	Symbol	Characteristics⁽¹⁾	Min.	Typical	Max.	Units	Conditions
SSP_1	FSCK	SCK Frequency	—	—	14.2	MHz	Receiver mode, C_LOAD = 30 pF(max).
			—	—	4.63		Full Duplex Transmit and Receive mode, C_LOAD = 30 pF(max). Loop-Back mode with one SPI talking to another SPI on the same MCU.
			—	—	1/(2*(TSOV+NOTE2_TMIS))⁽²⁾		Full Duplex Transmit and Receive mode, C_LOAD = 30 pF(max). The maximum SPI speed of the MCU is partially dependent on the external SPI device performance characteristics. Faster speeds than the Loop-Back mode above may therefore be possible using the formula.
SSP_11	TSOV	MOSI Data Output Valid after SCK	—	—	56.1	ns	VDDIO = 3.3V, C_LOAD = 30 pF(max)
SSP_15	TSIS	MISO Setup Time of Data Input to SCK	14.6	—	—	ns	VDDIO = 3.3V, C_LOAD = 30 pF(max)
Note: Assumes VDDIO(min) and 30 pF external load on all SPIx pins unless otherwise noted. NOTE2_TMIS is the host external device setup time.