35.2 Absolute Maximum Ratings

Stresses beyond those listed in this section can cause permanent damage to the device and are for stress rating purposes only. The device's functional operation at these or other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Table 35-1. Absolute Maximum Ratings
Parameter	Rating	Units	Condition
Ambient temperature under bias	-40 to +125	°C
Maximum junction temperature	+140	°C
Storage temperature	-65 to +150	°C
Voltage on Pins with Respect to GND
On the V_DD pins	-0.3 to +6.0	V
On the RESET pin	-0.3 to +9.0	V
On all other pins	-0.3 to (V_DD + 0.3)	V
Maximum Current
On the GND pins⁽¹⁾	200	mA	-40°C ≤ T_A ≤ +85°C
On the GND pins⁽¹⁾	100	mA	+85°C < T_A ≤ +125°C
On the V_DD pins⁽¹⁾	200	mA	-40°C ≤ T_A ≤ +85°C
On the V_DD pins⁽¹⁾	100	mA	+85°C < T_A ≤ +125°C
On any standard I/O pin	±40	mA
Clamp current, I_K (V_PIN < 0 or V_PIN > V_DD)	±20	mA
Total power dissipation⁽²⁾	800	mW
Note: The maximum current rating requires even load distribution across I/O pins. The maximum current rating may be limited by the device package power dissipation characterizations. See the Thermal Characteristics section to calculate device specifications. Calculate power dissipation as follows: P_DIS = V_DD × {I_DD - Σ I_OH} + Σ {(V_DD - V_OH) × I_OH} + Σ (V_OL × I_OL)