2.9.1 Selecting the Memory Device

The Fabric DDR subsystem supports DDR3, DDR3L, DDR4, and LPDDR3 memory devices.

The memory that is used with the system depends on the application requirements. No single memory device can fulfill all system requirements; therefore, the trade-offs associated with each memory type must be considered for a balanced design.

Consider the following factors while selecting the memory device:

  • Cost
  • Bandwidth and speed
  • Power consumption
  • Bus width
  • Latency
  • Capacity

The following table lists the memory parameters for DDR3, DDR3L, DDR4, and LPDDR3 memory devices. Based on the system requirements (bandwidth, speed, bus width, density, and cost), the appropriate memory device is selected.

Table 2-27. Memory Selection Parameters
ParameterDDR3DDR3LDDR4LPDDR3
DDR clock666666800666
Data width (in bits)16, 32, 6416, 32, 6416, 32, 6416, 32
Burst length (in bytes)8888
Number of banks888,168
Density512 Mb–8192 Mb512 Mb–8192 Mb2 Gb–16 Gb32 Gb
I/O standardSSTL-15 Class I, IISSTL-135 Class I, IIPOD-12 Class I, II*HSUL-12
Note: HSTL_12 IO standard is used for DDR4 address, command, and control signals.