2.2.3 Power Consumption of Various Internal Resources

Table 2-14. Different Components Contributing to Dynamic Power Consumption in SmartFusion cSoCs
Parameter Definition Power Supply Device Units
Name Domain A2F0604 A2F500
PAC1 Clock contribution of a Global Rib VCC 1.5V 3.39 5.05 µW/MHz
PAC2 Clock contribution of a Global Spine VCC 1.5V 1.14 2.50 µW/MHz
PAC3 Clock contribution of a VersaTile row VCC 1.5V 1.15 1.15 µW/MHz
PAC4 Clock contribution of a VersaTile used as a sequential module VCC 1.5V 0.12 0.12 µW/MHz
PAC5 First contribution of a VersaTile used as a sequential module VCC 1.5V 0.07 0.07 µW/MHz
PAC6 Second contribution of a VersaTile used as a sequential module VCC 1.5V 0.29 0.29 µW/MHz
PAC7 Contribution of a VersaTile used as a combinatorial module VCC 1.5V 0.29 0.29 µW/MHz
PAC8 Average contribution of a routing net VCC 1.5V 1.04 0.79 µW/MHz
PAC9 Contribution of an I/O input pin (standard dependent) VCCxxxxIOBx/VCC See Table 2-10 and Table 2-11
PAC10 Contribution of an I/O output pin (standard dependent) VCCxxxxIOBx/VCC See Table 2-12 and Table 2-13
PAC11 Average contribution of a RAM block during a read operation VCC 1.5V 25.00 µW/MHz
PAC12 Average contribution of a RAM block during a write operation VCC 1.5V 30.00 µW/MHz
PAC13 Dynamic Contribution for PLL VCC 1.5V 2.60 µW/MHz
PAC15 Contribution of NVM block during a read operation (F < 33MHz) VCC 1.5V 358.00 µW/MHz
PAC16 1st contribution of NVM block during a read operation (F > 33MHz) VCC 1.5V 12.88 mW
PAC17 2nd contribution of NVM block during a read operation (F > 33MHz) VCC 1.5V 4.80 µW/MHz
PAC18 Main Crystal Oscillator contribution VCCMAINXTAL 3.3V 1.98 mW
PAC19a RC Oscillator contribution VCCRCOSC 3.3V 3.30 mW
PAC19b RC Oscillator contribution VCC 1.5V 3.00 mW
PAC20a Analog Block Dynamic Power Contribution of the ADC VCC33ADCx 3.3V 8.25 mW
PAC20b Analog Block Dynamic Power Contribution of the ADC VCC15ADCx 1.5V 3.00 mW
PAC21 Low Power Crystal Oscillator contribution VCCLPXTAL 3.3V 33.00 µW
PAC22 MSS Dynamic Power Contribution – Running Drysthone at 100MHz1 VCC 1.5V 67.50 mW
PAC23 Temperature Monitor Power Contribution See Table 2-94 — 1.23 mW
PAC24 Current Monitor Power Contribution See Table 2-93 — 1.03 mW
PAC25 ABPS Power Contribution See Table 2-97 — 0.70 mW
PAC26 Sigma-Delta DAC Power Contribution2 See Table 2-99 — 0.58 mW
PAC27 Comparator Power Contribution See Table 2-98 — 1.02 mW
PAC28 Voltage Regulator Power Contribution3 See Table 2-100 — 36.30 mW
Note:
  1. For a different use of MSS peripherals and resources, refer to SmartPower.
  2. Assumes Input = Half Scale Operation mode.
  3. Assumes 100 mA load on 1.5V domain.
  4. Device A2F060 is discontinued.
Table 2-15. Different Components Contributing to the Static Power Consumption in SmartFusion cSoCs
Parameter Definition Power Supply Device Units
Name Domain A2F0601 A2F500
PDC1 Core static power contribution in SoC mode VCC 1.5V 7.80 37.95 mW
PDC2 Device static power contribution in Standby Mode See Table 2-8 — 7.80 37.95 mW
PDC3 Device static power contribution in Time Keeping mode See Table 2-8 3.3V 33.00 33.0 µW
PDC7 Static contribution per input pin (standard dependent contribution) VCCxxxxIOBx/VCC See Table 2-10 and Table 2-11.
PDC8 Static contribution per output pin (standard dependent contribution) VCCxxxxIOBx/VCC See Table 2-12 and Table 2-13.
PDC9 Static contribution per PLL VCC 1.5V 2.55 2.55 mW
Note:
  1. Device A2F060 is discontinued.
Table 2-16. eNVM Dynamic Power Consumption
Parameter Description Condition Min. Typ. Max. Units
eNVM System eNVM array operating power Idle — 795 — µA
Read operation See Table 2-14.
Erase — 900 — µA
Write — 900 — µA
PNVMCTRL eNVM controller operating power — — 20 — µW/MHz