32.1 Absolute Maximum Ratings

Absolute maximum ratings for are listed below. Exposure to these maximum rating conditions for extended periods may affect device reliability. Functional operation of the device at these or any other conditions, above the parameters indicated in the operation listings of this specification, is not implied.

Table 32-1. MCU Absolute Maximum Electrical Characteristics
Ambient temperature under bias-40°C to +125°C
Storage temperature -60°C to +150°C
Voltage on VDDIO with respect to GND-0.3V to +3.8V
Voltage on any pins, with respect to GND(3)-0.3V to (VDDIO+0.3V)
Voltage on VREFA/B with respect to AVDD-0.3V to (AVDD+0.3V)
Maximum current out of GND pins130 mA
Maximum current into VDDIO pins(2)92 mA
Maximum output current sourced/sunk by any Low-Current Mode I/O pin10 mA
Maximum output current sourced/sunk by any High-Current Mode I/O pin20 mA
Maximum current sunk by all ports 129 mA
Maximum current sourced by all ports(2)129 mA
Maximum Junction Temperature +145°C
ESD qualification:
Human Body Model (HBM) per JESD22-A1142000V
Charged Device Model (CDM) (ANSI/ESD STM 5.3.1)…(All pins/Corner pins)500V/750V
Note:
  1. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions, above those indicated in the operation listings of this specification, is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
  2. Maximum allowable current is a function of device maximum power dissipation.
  3. When applying higher or lower voltage than those specified on the I/O pins, refer to DI_19/DI_21 to respect the maximum injection current specification.