1.3.3.1 Packaging Decoupling Capacitors

PolarFire SoC 0.8 mm and 1.0 mm pitch packages contain decoupling capacitors to support high-speed I/O operation.

Small, low-profile CSP packages (0.5 mm ball pitch, 16 mm × 16 mm, and smaller) do not have package decoupling capacitors.

The following table lists the packaging decoupling capacitors contained in non-CSP packages.

Table 1-4. Decoupling Capacitor per Die-Package
Supply NameBank No./IO TypeCapacitor RatingFCG1152, 35 x 35 mm, 
1.0 mmFCVG784, 23 x 23 mm, 0.8 mmFCVG484, 19 x 19 mm, 0.8 mm
MPFS460TMPFS250TMPFS250TMPFS160TMPFS095TMPFS250TMPFS160TMPFS095TMPFS025T
VDDASerDes Power4.7 nF111111111
VDDASerDes Power2.2 nF11111
VDDASerDes Power1.5 nF11111
VDDASerDes Power1.0 nF111111111
VDDI0Bank 0/HSIO Bank Power1.0 µF11111
VDDI8Bank 8/HSIO Bank Power1.0 µF11111
VDDI6Bank 6/HSIO - DDR Bank Power1.0 µF11111
VDD18HSIO/MSS_DDR Input Power1.0 µF11111
VDDI1Bank 1/GPIO Bank Power1.0 µF11111
VDDI9Bank 9/GPIO Bank Power1.0 µF11111
VDDI7Bank 7/GPIO Bank Power1.0 µF11111
VDDI2Bank 2/MSSIO Bank Power
VDDI4Bank 4/MSSIO Bank Power
VDDI5Bank-5/MSS SGMII Bank Power, 
Pre-Driver
VDD25PGM, PLL Power1.0 µF11111
VDDCore Power2.2 µF11111
Total Number of Capacitors13131313132222
Note: FCSG536 and FCSG325 do not have package capacitors.