50.9 Thermal Characteristics

Table 50-6.
Standard Operating Conditions (unless otherwise stated)
Param No.	Sym.	Characteristic	Typ.	Units	Conditions
TH01	θ_JA	Thermal Resistance Junction to Ambient	57.1	°C/W	28-pin SPDIP package
			46.0	°C/W	28-pin SOIC package
			54.5	°C/W	28-pin SSOP package
			36.5	°C/W	28-pin VQFN package
TH02	T_JMAX	Maximum Junction Temperature	150	°C
Note: See “Absolute Maximum Ratings” for total power dissipation.

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