31.22 Serial Peripheral Interface (SPI) Mode Electrical Specifications

Figure 31-4. SERCOM SPIx Host Module (CPHA = 0) Timing Diagrams

Figure 31-5. SERCOM SPIx Host Module (CPHA = 1) Timing Diagrams

Table 31-30. SERCOM SPIx Module Host Mode Electrical Specifications⁽¹⁾
AC CHARACTERISTICS			Standard Operating Conditions: VDDIO = AVDD = VDD 1.62V to 3.63V (unless otherwise stated) Operating Temperature: -40°C ≤ TA ≤ +85°C for Industrial
Param. No.	Symbol	Characteristics⁽¹⁾	Min.	Typ.	Max.	Units	Conditions
MSP_1	FSCK	SCK Frequency	—	—	8	MHz	Transmitter mode, CTRLB.RXEN = 0, C_LOAD = 30 pF(max).
MSP_1	FSCK	SCK Frequency	—	—	1/(2*(TMIS+NOTE2_TV)⁽²⁾	MHz	Full Duplex Transmit and Receive mode, C_LOAD = 30 pF(max). The max SPI speed of the MCU is partially dependent on the external SPI device performance characteristics. Faster speeds than the loop- back mode above may therefore be possible using the formula.
MSP_3	TSCL	SCK Output Low Time	1/(2*FSCK)	—	—	ns	—
MSP_5	TSCH	SCK Output High Time	1/(2*FSCK)	—	—	ns	—
MSP_7	TSCF	SCK and MOSI Output Fall Time	—	—	DI27	ns	See parameter DI27 in the I/O Specifications
MSP_9	TSCR	SCK and MOSI Output Rise Time	—	—	DI25	ns	See parameter DI25 in the I/O Specifications
MSP_11	TMOV	MOSI Data Output Valid after SCK	—	—	62.5	ns	VDDIO(min), C_LOAD = 30 pF(max)
MSP_13	TMOH	MOSI hold after SCK	2.5	—	—	ns
MSP_15	TMIS	MISO Setup Time of Data Input to SCK	50.7	—	—	ns
MSP_17	TMIH	MISO Hold Time of Data Input to SCK	0	—	—	ns
MSP_19	SPI_GCLK	SERCOM SPI input clock frequency, GCLK_SPI	—	—	FCLK_23	MHz	—
Note: Assumes VDDIO(min) and 30 pF external load on all SPIx pins unless otherwise noted. NOTE2_TV is the Client external device data output valid time from clock edge specification.

Figure 31-6. SERCOM SPIx Client Module (CPHA = 0) Timing Diagrams

Figure 31-7. SERCOM SPIx Client Module (CPHA = 1) Timing Diagrams

Table 31-31. SERCOM SPIx Module Client Mode Electrical Specifications⁽¹⁾
AC CHARACTERISTICS			Standard Operating Conditions: VDDIO = AVDD = VDD 1.62V to 3.63V (unless otherwise stated) Operating Temperature: -40°C ≤ TA ≤ +85°C for Industrial
Param. No.	Symbol	Characteristics⁽¹⁾	Min.	Typical	Max.	Units	Conditions
SSP_1	FSCK	SCK Frequency	—	—	8	MHz	Receiver mode, C_LOAD = 30 pF(max).
SSP_1	FSCK	SCK Frequency	—	—	1/(2*(TSOV+NOTE2_TMIS)) ⁽²⁾	MHz	Full Duplex Transmit and Receive mode, C_LOAD= 30 pF(max). The maximum SPI speed of the MCU is partially dependent on the external SPI device performance characteristics. Faster speeds than the loop back mode above may therefore be possible using the formula.
SSP_3	TSCL	SCK Output Low Time	1/(2*FSCK)	—	—	ns	—
SSP_5	TSCH	SCK Output High Time	1/(2*FSCK)	—	—	ns	—
SSP_7	TSCF	SCK and MOSI Output Fall Time	—	—	DI27	ns	See parameter DI27 in the I/O Specifications
SSP_9	TSCR	SCK and MOSI Output Rise Time	—	—	DI25	ns	See parameter DI25 in the I/O Specifications
SSP_11	TSOV	MOSI Data Output Valid after SCK	—	—	42.5	ns	VDDIO = 3.3V, C_LOAD = 30 pF(max)
SSP_13	TSOH	MOSI hold after SCK	11.9	—	—	ns
SSP_15	TSIS	MISO Setup Time of Data Input to SCK	(1/(2*FSCK)) - 19	—	—	ns
SSP_17	TSIH	MISO Hold Time of Data Input to SCK	(1/(2*FSCK)) - 5	—	—	ns
SSP_19	TSSS	SS setup to SCK (PRELOADEN=1)	2*tck_APB	—	—	ns
SSP_19	TSSS	SS setup to SCK (PRELOADEN=0)	7	—	—	ns
SSP_21	TSSH	SS hold after SCK Client	(1/(2*FSCK)) - 9	—	—	ns
SSP_23	SPI_GCLK	SERCOM SPI input clock frequency, GCLK_SPI	—	—	FCLK_23	MHz	—
Note: Assumes VDDIO(min) and 30 pF external load on all SPIx pins unless otherwise noted. NOTE2_TMIS is the Host external device setup time.