31.22 Serial Peripheral Interface (SPI) Mode Electrical Specifications

Figure 31-4. SERCOM SPIx Host Module (CPHA = 0) Timing Diagrams
Figure 31-5. SERCOM SPIx Host Module (CPHA = 1) Timing Diagrams
Table 31-30. SERCOM SPIx Module Host Mode Electrical Specifications(1)
AC CHARACTERISTICSStandard Operating Conditions: VDDIO = AVDD = VDD 1.62V to 3.63V (unless otherwise stated)

Operating Temperature:

-40°C ≤ TA ≤ +85°C for Industrial

Param. No.SymbolCharacteristics(1)Min.Typ.Max.UnitsConditions
MSP_1FSCKSCK Frequency——8MHzTransmitter mode, CTRLB.RXEN = 0,

CLOAD = 30 pF(max).

——1/(2*(TMIS+NOTE2_TV)(2)Full Duplex Transmit and Receive mode, CLOAD = 30 pF(max).

The max SPI speed of the MCU is partially dependent on the external SPI device performance characteristics.

Faster speeds than the loop- back mode above may therefore be possible using the formula.

MSP_3TSCLSCK Output Low Time1/(2*FSCK)——ns—
MSP_5TSCHSCK Output High Time1/(2*FSCK)——ns—
MSP_7TSCFSCK and MOSI Output Fall Time——DI27nsSee parameter DI27 in the I/O Specifications
MSP_9TSCRSCK and MOSI Output Rise Time——DI25nsSee parameter DI25 in the I/O Specifications
MSP_11TMOVMOSI Data Output Valid after SCK——62.5nsVDDIO(min), CLOAD = 30 pF(max)
MSP_13TMOHMOSI hold after SCK2.5——ns
MSP_15TMISMISO Setup Time of Data Input to SCK50.7——ns
MSP_17TMIHMISO Hold Time of Data Input to SCK0——ns
MSP_19SPI_GCLKSERCOM SPI input clock frequency, GCLK_SPI——FCLK_23MHz —
Note:
  1. Assumes VDDIO(min) and 30 pF external load on all SPIx pins unless otherwise noted.
  2. NOTE2_TV is the Client external device data output valid time from clock edge specification.
Figure 31-6. SERCOM SPIx Client Module (CPHA = 0) Timing Diagrams
Figure 31-7. SERCOM SPIx Client Module (CPHA = 1) Timing Diagrams
Table 31-31. SERCOM SPIx Module Client Mode Electrical Specifications(1)
AC CHARACTERISTICSStandard Operating Conditions: VDDIO = AVDD = VDD 1.62V to 3.63V (unless otherwise stated)

Operating Temperature:

-40°C ≤ TA ≤ +85°C for Industrial

Param. No.SymbolCharacteristics(1)Min.TypicalMax.UnitsConditions
SSP_1FSCKSCK Frequency——8MHzReceiver mode, CLOAD = 30 pF(max).
——1/(2*(TSOV+NOTE2_TMIS)) (2)Full Duplex Transmit and Receive mode, CLOAD= 30 pF(max).

The maximum SPI speed of the MCU is partially dependent on the external SPI device performance characteristics.

Faster speeds than the loop back mode above may therefore be possible using the formula.

SSP_3TSCLSCK Output Low Time1/(2*FSCK)——ns—
SSP_5TSCHSCK Output High Time1/(2*FSCK)——ns—
SSP_7TSCFSCK and MOSI Output Fall Time——DI27nsSee parameter DI27 in the I/O Specifications
SSP_9TSCRSCK and MOSI Output Rise Time——DI25nsSee parameter DI25 in the I/O Specifications
SSP_11TSOVMOSI Data Output Valid after SCK——42.5nsVDDIO = 3.3V, CLOAD = 30 pF(max)
SSP_13TSOHMOSI hold after SCK11.9——ns
SSP_15TSISMISO Setup Time of Data Input to SCK(1/(2*FSCK)) - 19——ns
SSP_17TSIHMISO Hold Time of Data Input to SCK(1/(2*FSCK)) - 5——ns
SSP_19TSSSSS setup to SCK (PRELOADEN=1)2*tck_APB——ns
SS setup to SCK (PRELOADEN=0)7——ns
SSP_21TSSHSS hold after SCK Client(1/(2*FSCK)) - 9——ns
SSP_23SPI_GCLKSERCOM SPI input clock frequency, GCLK_SPI——FCLK_23MHz—
Note:
  1. Assumes VDDIO(min) and 30 pF external load on all SPIx pins unless otherwise noted.
  2. NOTE2_TMIS is the Host external device setup time.