31.2 General Operating Ratings and Thermal Conditions

The device must operate within the ratings listed in the following tables in order for all other electrical characteristics and typical characteristics of the device to be valid.

Table 31-2. Operating Frequency and Voltage
Param. No.VDDIO, VDDIN, AVDD RangeTemp. Range (in °C)Max MCU FrequencyComments
DC_51.62 to 3.63V (1)-40°C to +85°C48 MHzIndustrial
Note:
  1. With BOD33 disabled. If the BOD33 is enabled, refer to parameter REG_47.
Table 31-3. MCU Thermal Operating Conditions
RatingSymbolMin.Typ.Max.Unit
Industrial Temperature Devices:

Operating Ambient Temperature Range

Operating Junction Temperature Range

TA

TJ

-40

—

—85

100

°C

°C

Power Dissipation:

Internal Chip Power Dissipation:

PINT = (VDDIO x (IDD –∑ IOHVDDIO)) + (VDDCORE x IDDCORE) + (AVDD x (IDDANA - ∑ IOHAVDD)) + (VDDREG x IDDREG)

I/O Pin Power Dissipation:

PI/O = ∑ ((VDDIO – VOHVDDIO) x IOHVDDIO) + ∑ (VOL x IOLVDDIO) + ∑ ((AVDD – VOHAVDD) x IOHAVDD) + ∑ (VOL x IOLAVDD)

PDPINT + PI/OW
Maximum Allowed Power DissipationPDMAX(TJ – TA)/θJAW
Table 31-4. Thermal Packaging Characteristics (1)
CharacteristicsSymbolTyp.Max.Unit
Thermal Resistance, 32-pin TQFP (7x7x1 mm) PackageθJA63.1—°C/W
Thermal Resistance, 48-pin TQFP (7x7x1 mm) PackageθJA62.7—°C/W
Thermal Resistance, 64-pin TQFP (10x10x1 mm) PackageθJA56.3—°C/W
Thermal Resistance, 32-pin VQFN (5x5x1 mm) PackageθJA40.9—°C/W
Thermal Resistance, 48-pin VQFN (7x7x0.9 mm) PackageθJA30.9—°C/W
Thermal Resistance, 64-pin VQFN (9x9x1 mm) PackageθJA31.4—°C/W
Note:
  1. Junction to ambient thermal resistance, Theta-JA (θJA) numbers are achieved by package simulations.