39.21 Serial Peripheral Interface (SPI) Mode Electrical Specifications

Figure 39-4. SPIx Host Module (CPHA = 0) Timing Diagrams

Figure 39-5. SPIx Host Module (CPHA = 1) Timing Diagrams

Table 39-27. SERCOM SPIx Module Host Mode Electrical Specifications⁽¹⁾
AC CHARACTERISTICS			Standard Operating Conditions: VDD and VDDIO 2.7V to 5.5V (unless otherwise stated) Operating temperature: -40°C ≤ TA ≤ +85°C for Industrial
Param. No.	Symbol	Characteristics⁽¹⁾	Min.	Typ.	Max.	Units	Conditions
MSP_1	FSCK	SCK Frequency	—	—	14.56	MHz	Transmitter mode, CTRLB.RXEN = 0, CLOAD = 30 pF(max).
			—	—	4.72		Full Duplex Transmit and Receive mode, CLOAD = 30 pF(max). Loop-Back mode with one SPI talking to another SPI on the same MCU.
			—	—	1/(2*(TMIS+NOTE2_TV))⁽²⁾		Full Duplex Transmit and Receive mode, CLOAD = 30 pF(max). The max SPI speed of the MCU is partially dependent on the external SPI device performance characteristics. Faster speeds than the Loop-Back mode above may therefore be possible using the formula.
MSP_3	TSCL	SCK Output Low Time	1/(2*FSCK)	—	—	ns	—
MSP_5	TSCH	SCK Output High Time	1/(2*FSCK)	—	—	ns	—
MSP_7	TSCF	SCK and MOSI Output Fall Time	—	—	DI27	ns	See parameter DI27 I/O spec
MSP_9	TSCR	SCK and MOSI Output Rise Time	—	—	DI25	ns	See parameter DI25 I/O spec
MSP_11	TMOV	MOSI Data Output Valid after SCK	—	—	23.6	ns	VDDIO(min), CLOAD = 30 pF(max)
MSP_13	TMOH	MOSI hold after SCK	2.5	—	—	ns
MSP_15	TMIS	MISO Setup Time of Data Input to SCK	50.7	—	—	ns
MSP_17	TMIH	MISO Hold Time of Data Input to SCK	0	—	—	ns
MSP_19	SPI_GCLK	SERCOM SPI input clock frequency GCLK_SPI	—	—	FCLK_23	MHz	—
Note: Assumes VDDIO(min) and 30 pF external load on all SPIx pins unless otherwise noted. NOTE2_TV is the client external device data output valid time from clock edge specification.

Figure 39-6. SPIx Client Module (CPHA = 0) Timing Diagrams

Figure 39-7. SPIx Client Module (CPHA = 1) Timing Diagrams

Table 39-28. SERCOM SPIx Module Client Mode Electrical Specifications
AC CHARACTERISTICS			Standard Operating Conditions: VDD and VDDIO 2.7V to 5.5V (unless otherwise stated) Operating temperature: -40°C ≤ TA ≤ +85°C for Industrial
Param. No.	Symbol	Characteristics⁽¹⁾	Min.	Typical	Max.	Units	Conditions
SSP_1	FSCK	SCK Frequency	—	—	14.56	MHz	Receiver mode, CLOAD = 30 pF(max).
			—	—	4.72		Full Duplex Transmit and Receive mode, CLOAD = 30 pF(max). Loop Back mode with one SPI talking to another SPI on the same MCU.
			—	—	1/(2*(TSOV+NOTE2_TMIS))⁽²⁾		Full Duplex Transmit and Receive mode, CLOAD = 30 pF(max). The maximum SPI speed of the MCU is partially dependent on the external SPI device performance characteristics. Faster speeds than the Loop-Back mode above may therefore be possible using the formula.
SSP_3	TSCL	SCK Output Low Time	1/(2*FSCK)	—	—	ns	—
SSP_5	TSCH	SCK Output High Time	1/(2*FSCK)	—	—	ns	—
SSP_7	TSCF	SCK and MOSI Output Fall Time	—	—	DI27	ns	See parameter DI27 I/O spec
SSP_9	TSCR	SCK and MOSI Output Rise Time	—	—	DI25	ns	See parameter DI25 I/O spec
SSP_11	TSOV	MOSI Data Output Valid after SCK	—	—	55.1	ns	VDDIO = 3.3V, CLOAD = 30 pF(max)
SSP_13	TSOH	MOSI hold after SCK	11.9	—	—	ns
SSP_15	TSIS	MISO Setup Time of Data Input to SCK	13.6	—	—	ns
SSP_17	TSIH	MISO Hold Time of Data Input to SCK	0	—	—	ns
SSP_19	TSSS	SS setup to SCK (PRELOADEN = 1)	2*tck_APB	—	—	ns
SSP_19	TSSS	SS setup to SCK (PRELOADEN = 0)	0	—	—	ns
SSP_21	TSSH	SS hold after SCK Client	1/(2*FSCK)	—	—	ns
SSP_23	SPI_GCLK	SERCOM SPI input clock frequency, GCLK_SPI	—	—	FCLK_23	MHz	—
Note: Assumes VDDIO(min) and 30 pF external load on all SPIx pins unless otherwise noted. NOTE2_TMIS is the host external device setup time.