39.3 Power Supply
DC CHARACTERISTICS | Standard
Operating Conditions: VDD and VDDIO 2.7V to 5.5V (unless otherwise
stated) Operating temperature: -40°C ≤ TA ≤ +85°C for Industrial | ||||||
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Param. No. | Symbol | Characteristics | Min. | Typ. | Max. | Units | Conditions |
REG_1 | VDDCORE_CIN(1) | VDDCORE Input Bypass parallel Capacitor pair | 0.8 | 1 | 1.2 | µF | Bulk Ceramic or solid Tantalum with
ESR <0.5Ω. Minimum and maximum represent absolute values including cap tolerances. |
REG_3 | 80 | 100 | — | nF | Ceramic X7R with ESR <0.5Ω | ||
REG_4 | VDDIO_CIN(1) | VDDIO Input Bypass parallel Capacitor pair | 8 | 10(6) | — | µF | Bulk Ceramic or solid Tantalum with ESR <0.5Ω(2) |
REG_5 | 80 | 100 | — | nF | Ceramic X7R with ESR <0.5Ω on all VDDIO pins | ||
REG_7 | VDDIN_CIN(1) | VDDIN Input Bypass parallel Capacitor pair | 8 | 10(7) | — | µF | Bulk Ceramic or solid Tantalum with ESR <0.5Ω(2) |
REG_8 | 80 | 100 | — | nF | Ceramic X7R with ESR <0.5Ω on all VDDIO pins | ||
REG_9 | VREFA_CIN(1) | External VREFA Input Bypass parallel Capacitor pair | 3.76 | 4.7 | — | µF | Bulk Ceramic or solid Tantalum with ESR <0.5Ω |
80 | 100 | — | nF | Ceramic X7R with ESR <0.5Ω | |||
REG_17 | AVDD_CIN(1) | AVDD Input Bypass parallel Capacitor pair | 8 | 10 | — | µF | Bulk Ceramic or solid Tantalum with ESR <0.5Ω(2) |
REG_19 | 80 | 100 | — | nF | Ceramic X7R with ESR <0.5Ω | ||
REG_23 | AVDD_LEXT | AVDD series Ferrite Bead DCR (DC Resistance) | — | — | 0.1 | Ω | ≥600 Ω at 100 MHz |
REG_25 | Ferrite Bead current Rating | 500 | — | — | mA | ||
REG_36 | VDDCORE | DC calibrated output voltage | 1.08 | 1.23 | 1.32 | V | — |
REG_37 | VDDIO, VDDIN, AVDD(3) | VDDIO, VDDIN, AVDD Input Voltage Range | 2.7 | — | 5.5 | V | — |
REG_43 | SVDDIO/VDD_R | VDDIN, AVDD, VDDIO Rise Ramp Rate to Ensure Internal Power-on Reset Signal | — | — | 0.1 | V/µs | Failure to meet this specification may lead to start-up or unexpected behaviors |
REG_44 | SVDDIO/VDD_F | VDDIN, AVDD, VDDIO Fall Ramp Rate to Ensure Internal Power-on Reset Signal | — | — | 0.05 | V/µs | Failure to meet this specification may cause the device to not detect reset |
REG_45A | VPOR+ | VDDIO/VDD Rising Power-on Reset | 2.55 | V | VDDIO/VDD power-up/power-down (See Param REG43, VDDIO/VDD Rise Ramp Rate) | ||
REG_45B | VPOR- | VDDIO/VDD Falling Power-on Reset | 1.53 | 1.75 | 1.97 | V | VDDIO/VDD power-up/power-down (See Param REG43, VDDIO/VDD Fall Ramp Rate) |
REG_47 | VBODVDD(4,5) | VDD BOD (All modes)(4,5) | 2.71 | — | 2.97 | V | (Default Setting) LEVEL[ 5:0] = 0x8(4) HYST[0] = 0x0 |
2.71 | — | 3.05 | V | (Default Setting) LEVEL[5:0] = 0x8(4,5) HYST[0] = 0x1 | |||
4.37 | — | 4.81 | V | LEVEL[ 5:0] = 0x2C(4) HYST[0] = 0x0 | |||
4.37 | — | 4.88 | V | LEVEL[ 5:0] = 0x2C(4,5) HYST[0] = 0x1 | |||
REG_51 | VBODVDDLEVEL_STEP | VBODVDD step size, LEVEL[7:0] | — | 46 | — | mV | Step Size |
REG_52 | VBODVDDHYST_STEP | VBODVDD Hysterisis step size, HYST[3:0] | — | (See Note 5) | — | mV | Step Size |
REG_53 | TRST | External RESET valid active pulse width | 1 | — | — | µs | Minimum reset active time to guarantee MCU reset |
Note:
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