39.3 Power Supply

Table 39-5. Power Supply DC Electrical Specifications
DC CHARACTERISTICSStandard Operating Conditions: VDD and VDDIO 2.7V to 5.5V (unless otherwise stated)

Operating temperature:

-40°C ≤ TA ≤ +85°C for Industrial

Param. No.SymbolCharacteristicsMin.Typ.Max.UnitsConditions
REG_1VDDCORE_CIN(1)VDDCORE Input Bypass parallel Capacitor pair0.811.2µFBulk Ceramic or solid Tantalum with ESR <0.5Ω.

Minimum and maximum represent absolute values including cap tolerances.

REG_380100nFCeramic X7R with ESR <0.5Ω
REG_4VDDIO_CIN(1)VDDIO Input Bypass parallel Capacitor pair810(6)µFBulk Ceramic or solid Tantalum with ESR <0.5Ω(2)
REG_580100nFCeramic X7R with ESR <0.5Ω on all VDDIO pins
REG_7VDDIN_CIN(1)VDDIN Input Bypass parallel Capacitor pair810(7)µFBulk Ceramic or solid Tantalum with ESR <0.5Ω(2)
REG_880100nFCeramic X7R with ESR <0.5Ω on all VDDIO pins
REG_9VREFA_CIN(1)External VREFA Input Bypass parallel Capacitor pair 3.764.7µFBulk Ceramic or solid Tantalum with ESR <0.5Ω
80100nFCeramic X7R with ESR <0.5Ω
REG_17AVDD_CIN(1)AVDD Input Bypass parallel Capacitor pair810µFBulk Ceramic or solid Tantalum with ESR <0.5Ω(2)
REG_1980100nFCeramic X7R with ESR <0.5Ω
REG_23AVDD_LEXTAVDD series Ferrite Bead DCR (DC Resistance)0.1≥600 Ω at 100 MHz
REG_25Ferrite Bead current Rating500mA
REG_36VDDCOREDC calibrated output voltage1.081.231.32V
REG_37VDDIO, VDDIN, AVDD(3)VDDIO, VDDIN, AVDD Input Voltage Range2.75.5V
REG_43SVDDIO/VDD_RVDDIN, AVDD, VDDIO Rise Ramp Rate to Ensure Internal Power-on Reset Signal0.1V/µsFailure to meet this specification may lead to start-up or unexpected behaviors
REG_44SVDDIO/VDD_FVDDIN, AVDD, VDDIO Fall Ramp Rate to Ensure Internal Power-on Reset Signal0.05V/µsFailure to meet this specification may cause the device to not detect reset
REG_45AVPOR+VDDIO/VDD Rising Power-on Reset 2.55 VVDDIO/VDD power-up/power-down

(See Param REG43, VDDIO/VDD Rise Ramp Rate)

REG_45BVPOR-VDDIO/VDD Falling Power-on Reset 1.531.751.97VVDDIO/VDD power-up/power-down

(See Param REG43, VDDIO/VDD Fall Ramp Rate)

REG_47VBODVDD(4,5)VDD BOD (All modes)(4,5)2.712.97V(Default Setting) LEVEL[ 5:0] = 0x8(4) HYST[0] = 0x0
2.713.05V(Default Setting) LEVEL[5:0] = 0x8(4,5) HYST[0] = 0x1
4.374.81VLEVEL[ 5:0] = 0x2C(4) HYST[0] = 0x0
4.374.88VLEVEL[ 5:0] = 0x2C(4,5) HYST[0] = 0x1
REG_51VBODVDDLEVEL_STEPVBODVDD step size, LEVEL[7:0]46mVStep Size
REG_52VBODVDDHYST_STEPVBODVDD Hysterisis step size, HYST[3:0](See Note 5)mVStep Size
REG_53TRSTExternal RESET valid active pulse width1µsMinimum reset active time to guarantee MCU reset
Note:
  1. All bypass caps should be located immediately adjacent to pins and on the same side of the PCB as the MCU.
  2. In single power supply configuration, only one bulk capacitor (REG_4 or REG_7) is enough for both VDDIN and VDDIO. In dual-power supply configuration, two bulk capacitors are needed: REG_4 for VDDIO and REG_7 for VDDIN.
  3. VDDIN and AVDD must be at the same voltage level. VDDIO should be lower or equal to VDDIN/AVDD. The common voltage is referred to as VDD in the data sheet. Some I/O are in the VDDIO cluster, but can be multiplexed as analog inputs or outputs (e.g., PTC.X[n] pads). In such a case, AVDD is used to power the I/O. Using this configuration may result in an electrical conflict if the VDDIO voltage is lower than the VDDIN/AVDD.
  4. VBODVDD(min) = 2.341 + d(BODVDD.LEVEL[5:0]) * 0.046.
  5. VBODVDD(max) at BODVDD.HYST[0] = 1 = VBODVDD(max) at BODVDD.HYST[0] = 0 + VBODVDDHYST_STEP

    VBODVDDHYST_STEP Graph:

  6. Shared between VDDIO, VDDIN, and AVDD in case of a common power supply VDDIO = VDDIN = AVDD.
  7. Shared between VDDIO, VDDIN, and AVDD in case of a common power supply VDDIO = VDDIN = AVDD. Else, shared between VDDIN = AVDD.