46.21 SERCOM SPIx Mode Electrical Specifications

Figure 46-7. SPIx Host Module CPHA = 0 Timing Diagrams
Figure 46-8. SPIx Host Module CPHA = 1 Timing Diagrams
Table 46-27. SERCOM SPIx Module Host Mode Electrical Specifications
AC CHARACTERISTICS Standard Operating Conditions: VDD and VDDIO 2.7V to 5.5V (unless otherwise stated)

Operating temperature

-40°C ≤ TA ≤ +85°C for Industrial

Param. No. Symbol Characteristics(1) Min. Typ. Max. Units Conditions
MSP_1 FSCK SCK Frequency 14.56 MHz Transmitter mode, CTRLB.RXEN=0, CLOAD=30pF(MAX)
3.41 Full Duplex Transmit and Receive mode,

CLOAD=30pF(MAX)

Loop Back mode with one SPI talking to another SPI on the same MCU.

1/(2*(TMIS+NOTE2_TV)) (2) Full Duplex Transmit and Receive mode,

CLOAD=30pF(MAX).

The max SPI speed of the MCU is partially dependent on the external SPI device performance characteristics.

Faster speeds than the loop back mode above may therefore be possible using the formula.

MSP_3 TSCL SCK Output Low Time 1/(2*FSCK) ns
MSP_5 TSCH SCK Output High Time 1/(2*FSCK) ns
MSP_7 TSCF SCK & MOSI Output Fall Time DI_27 ns DI_27: Refer to I/O Pin Electrical Specification
MSP_9 TSCR SCK & MOSI Output Rise Time DI_25 ns DI_25: Refer to I/O Pin Electrical Specification
MSP_11 TMOV MOSI Data Output Valid after SCK 34.33 ns VDDIO = 2.7V, CLOAD=30pF(MAX)
MSP_13 TMOH MOSI hold after SCK 8.72 ns
MSP_15 TMIS MISO Setup Time of Data Input to SCK 72.96 ns
MSP_17 TMIH MISO Hold Time of Data Input to SCK 12.99 ns
MSP_19 SPI_GCLK SERCOM SPI input clk freq, GCLK_SERCOMx_CORE FCLK_23 MHz
Note:
  1. Assumes VDDIO = 2.7V and 30pF external load on all SPIx pins unless otherwise noted.
  2. NOTE2_TV is the client external device data output valid time from clock edge specification.
Figure 46-9. SPIx Client Module CPHA=0 Timing Diagram
Figure 46-10. SPIx Client Module CPHA=1 Timing Diagram
Table 46-28. SERCOM SPIx Module Client Mode Electrical Specifications
AC CHARACTERISTICS Standard Operating Conditions: VDD and VDDIO 2.7V to 5.5V (unless otherwise stated)

Operating temperature

-40°C ≤ TA ≤ +85°C for Industrial

Param. No. Symbol Characteristics(1) Min. Typ. Max. Units Conditions
SSP_1 FSCK SCK Frequency 14.56 MHz Receiver mode,

CLOAD=30pF(MAX)

3.41 Full Duplex Transmit and Receive mode,

CLOAD=30pF(MAX)

Loop Back mode with one SPI talking to another SPI on the same MCU.

1/(2*(TSOV+NOTE2_TMIS)) (2)

Full Duplex Transmit and Receive mode,

CLOAD=30pF(MAX).

The max SPI speed of the MCU is partially dependent on the external SPI device performance characteristics.

Faster speeds than the loop back mode above may therefore be possible using the formula.

SSP_3 TSCL SCK Output Low Time 1/(2*FSCK) ns
SSP_5 TSCH SCK Output High Time 1/(2*FSCK) ns
SSP_7 TSCF SCK & MISO Output Fall Time DI_27 ns DI_27: Refer to I/O Pin Electrical Specification
SSP_9 TSCR SCK & MISO Output Rise Time DI_25 ns DI_25: Refer to I/O Pin Electrical Specification
SSP_11 TSOV MISO Data Output Valid after SCK 77.5 ns VDDIO = 2.7V, CLOAD=30pF(MAX)
SSP_13 TSOH MISO hold after SCK 21.07 ns
SSP_15 TSIS MOSI Setup Time of Data Input to SCK 15.67 ns
SSP_17 TSIH MOSI Hold Time of Data Input to SCK 10.36 ns
SSP_19 TSSS SS setup to SCK (PRELOADEN=1) 2*tck_APB + 27.6 ns
SS setup to SCK (PRELOADEN=0) 27.6 ns
SSP_21 TSSH SS hold after SCK Client 8.59 ns
SSP_23 SPI_GCLK SERCOM SPI input clk freq, GCLK_SERCOMx_CORE FCLK_23 MHz
Note:
  1. Assumes VDDIO = 2.7V and 30 pF external load on all SPIx pins unless otherwise noted.
  2. NOTE2_TMIS is the host external device setup time.