46.11 XOSC Electrical Specifications
AC CHARACTERISTICS | Standard
Operating Conditions: VDD and VDDIO 2.7V to 5.5V (unless otherwise
stated) Operating temperature: -40°C ≤ TA ≤ +85°C for Industrial | ||||||
---|---|---|---|---|---|---|---|
Param. No. | Symbol | Characteristics | Min. | Typ. | Max. | Units | Conditions |
XOSC_1 | FOSC_XOSC | XOSC Crystal Frequency | 0.4 | — | 32 | MHz | XOSCCTRLn.XTALEN=1 XIN, XOUT Primary Osc |
XOSC_1A | TOSC | TOSC = 1/FOSC_XOSC | 31.25 | — | 2500 | ns | See parameter XOSC_1 for FOSC_XOSC value |
XOSC_2 | XOSC_ST (1,2) | XOSC Crystal Stabilization Time | — | 12300 | (3) | TOSC | Crystal stabilization time only, not
Oscillator Ready. CL = 20pF, XOSC.GAIN = 0,1,2,3,4 |
XOSC_3 | CXIN | XOSC XIN parasitic pin capacitance | — | 5.9 | — | pF | — |
XOSC_5 | CXOUT | XOSC XOUT parasitic pin capacitance | — | 3.1 | — | pF | — |
XOSC_11 | CLOAD (2) | XOSC Crystal FOSC = 0.455 MHz | — | — | 100 | pF | — |
XOSC_13 | XOSC Crystal FOSC = 2 MHz | — | — | 20 | pF | — | |
XOSC_15 | XOSC Crystal FOSC = 4 MHz | — | — | 20 | pF | — | |
XOSC_17 | XOSC Crystal FOSC = 8 MHz | — | — | 20 | pF | — | |
XOSC_19 | XOSC Crystal FOSC = 16 MHz | — | — | 20 | pF | — | |
XOSC_20 | XOSC Crystal FOSC = 32 MHz | — | — | 12 | pF | — | |
XOSC_21 | ESR | XOSC Crystal FOSC = 0.455 MHz | — | — | 443 | Ω | CL = 100pF, XOSC.GAIN = 0 |
XOSC_23 | XOSC Crystal FOSC = 2 MHz | — | — | 383 | Ω | CL = 20pF, XOSC.GAIN = 0 | |
XOSC_25 | XOSC Crystal FOSC = 4 MHz | — | — | 218 | Ω | CL = 20pF, XOSC.GAIN = 1 | |
XOSC_27 | XOSC Crystal FOSC = 8 MHz | — | — | 114 | Ω | CL = 20pF, XOSC.GAIN = 2 | |
XOSC_29 | XOSC Crystal FOSC = 16 MHz | — | — | 58 | Ω | CL = 20pF, XOSC.GAIN = 3 | |
XOSC_29 | XOSC Crystal FOSC = 32 MHz | — | — | 62 | Ω | CL = 12pF, XOSC.GAIN = 4 | |
XOSC_35 | FOSC_XCLK | Ext Clock Oscillator Input Freq (XIN pin) | 0 | — | 48 | MHz | XOSCCTRL.XTALEN=0 |
XOSC_37 | XCLK_DC | Ext Clock Oscillator (XIN) Duty Cycle | 40 | 50 | 60 | % | XOSCCTRL.XTALEN=0 |
XOSC_39 | XCLK_FST | Primary XIN Clock Fail Safe Time-out Period | — | 4*1/(OSC48M_1/2^OSCCTRL.CFDPRESC) | — | µs | — |
- This is for guidance only. A major component of crystal start-up time is based on the second party crystal MFG parasitics that are outside the scope of this specification. If this is a major concern the customer would need to characterize this based on their design choices.
- CRYSTAL LOAD CAPACITOR
CALCULATION
GIVEN:
- Standard PCB trace capacitance = 1.5 pF per 12.5 mm (0.5 inches) (i.e. PCB STD TRACE W = 0.175 mm, H = 36 μm, T = 113 μm)
- Xtal PCB capacitance typical therefore ~= 2.5pF for a tight PCB xtal layout
- For CXIN and CXOUT within
4pF of each other, Assume CXTAL_EFF = ((CXIN+CXOUT) / 2)Note: Averaging CXIN and CXOUT will effect final calculated CLOAD value by less than 0.25 pF.
EQUATION 1:
MFG CLOAD Spec = {( [CXIN + C1] * [CXOUT + C2] ) / [CXIN + C1 + C2 + CXOUT] } + estimated oscillator PCB stray capacitance
- Assuming C1 = C2 and CXIN ~= CXOUT, the formula can be further simplified and restated to solve for C1 and C2 by:
EQUATION 2: (Simplified version of equation 1)
C1 = C2 = ((2 * MFG CLOAD spec) - CXTAL_EFF - (2 * PCB capacitance))
EXAMPLE ONLY:
- XTAL Mfg CLOAD Data Sheet Spec = 12 pF
- PCB XTAL trace Capacitance = 2.5 pF
- CXIN pin = 6.5 pF, CXOUT pin = 4.5 pF. Therefore CXTAL_EFF = ((CXIN+CXOUT) / 2)
CXTAL_EFF = ((6.5 + 4.5)/2) = 5.5 pF
C1 = C2 = ((2 * MFG CLOAD spec) - CXTAL_EFF - (2 * PCB capacitance))
C1 = C2 = (24 - 5.5 - (2 * 2.5))
C1 = C2 = 13.5 pF (Always rounded down)
C1 = C2 = 13 pF (i.e., for hypothetical example crystal external load capacitors)
User C1=C2=13 pF ≤ CLOAD(max) spec
Figure 46-5. XTAL - User Selectable in OSCCTRL.STARTUP.
- Minimum value in order to respect the FDPLL96M minimum input frequency parameter (FDPLL_1). Only applicable when XOSC is used to feed the FDPLL96M.