46.1 Operating Frequencies and Thermal Limitations

Table 46-1. Operating Frequency vs. Voltage
Characteristic	VDDIO, VDDIN, AVDD Range	Temp. Range (in °C)	Max CPU Frequency	Comments
DC_5	2.7 to 5.5V ^{(1, 2, 3)}	-40°C to +85°C	48 MHz	Industrial

Note:

With BODVDD disabled. If the BODVDD is enabled, refer to parameter REG_47.
The same voltage must be applied to VDDIN and AVDD. This common voltage is referred to as VDD in the data sheet. VDDIO should be lower or equal to VDD.
Some I/Os are in the VDDIO cluster, but can be multiplexed as analog functions (inputs or outputs). In such a case, AVDD is used to power the I/O. Using this configuration may result in an electrical conflict if the VDDIO voltage is lower than VDD = VDDIN = AVDD.

Table 46-2. CPU Thermal Operating Conditions
Rating	Symbol	Min.	Typ.	Max.	Unit
Operating Ambient Temperature Range	T_A	-40	—	85	°C
Operating Junction Temperature Range	T_J	—	—	105	°C
Power Dissipation: Internal Chip Power Dissipation: P_INT = VDD x (IDD –∑ IOH_VDD) + VDDIO x (IDDIO –∑ IOH_VDDIO) I/O Pin Power Dissipation: PI/O = ∑ ({VDD – VOH} x IOH_VDD) + ∑ (VOL x IOL_VDD) + ∑ ({VDDIO – VOH} x IOH_VDDIO) + ∑ (VOL x IOL_VDDIO)	P_D	P_INT + P_I/O			W
Maximum Allowed Power Dissipation	P_DMAX	(T_J – T_A)/θ_JA			W

Table 46-3. Thermal Packaging Characteristics
Characteristics	Symbol	Typ.	Max.	Unit
Thermal Resistance, 32-pin TQFP (7x7x1 mm) Package	θ_JA	49.5	—	°C/W
Thermal Resistance, 48-pin TQFP (7x7x1 mm) Package	θ_JA	49.7	—	°C/W
Thermal Resistance, 64-pin TQFP (10x10x1 mm) Package	θ_JA	45.5	—	°C/W
Thermal Resistance, 100-pin TQFP (14x14x1 mm) Package	θ_JA	39.8	—	°C/W
Thermal Resistance, 32-pin VQFN (5x5x1 mm) Package	θ_JA	30.8	—	°C/W
Thermal Resistance, 48-pin VQFN (7x7x0.9 mm) Package	θ_JA	24.8	—	°C/W
Thermal Resistance, 64-pin VQFN (9x9x1 mm) Package	θ_JA	21.2	—	°C/W

Note:

Junction to ambient thermal resistance, Theta-JA (θ_JA) numbers are achieved by package simulations.