46 Electrical Characteristics at 85°C

Disclaimer

Unless otherwise specified:

  • Typical data are measured at TA = 25°C. They are for design guidance only and are not tested.
  • All minimum and maximum values are valid across operating temperature and voltage

Absolute Maximum Ratings

Absolute maximum ratings are listed below. Exposure to these maximum rating conditions for extended periods may affect device reliability. Functional operation of the device at these or any other conditions, above the parameters indicated in the operation listings of this specification, is not implied.

Absolute Maximum Ratings (1)
Ambient temperature under bias -40°C to + 125°C
Storage temperature -60°C to +150°C
Voltage on VDD with respect to GND -0.3V to +5.8V
Voltage on VDDIO with respect to GND -0.3V to +5.8V
Voltage on any pin with respect to GND (2) -0.3V to (VDD/VDDIO+0.3V)
Voltage on VREFA with respect to AVDD -0.3V to (AVDD+0.3V)
Maximum total current out of all GND pin(s) 129 mA
Maximum total current into all VDDIN, AVDD, and VDDIO pins (3) 129 mA
Maximum output current sourced/sunk by any non High-Sink I/O pin (4) 10 mA
Maximum output current sourced/sunk by any High-sink I/O pin (4) 20 mA
Maximum current sunk by all ports 129 mA
Maximum current sourced by all ports (3) 129 mA
Maximum Junction Temperature +145°C
ESD Qualification
Human Body Model (HBM) per JESD22-A114 2000V
Charged Device Model (CDM) (ANSI/ESD STM 5.3.1) (All pins / Corner pins) 500V / 750V
Note:
  1. Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions, above those indicated in the operation listings of this specification, is not implied. Exposure to maximum rating conditions for extended periods may affect the device reliability.
  2. When applying higher or lower voltage than those specified on I/O pins, refer to DI_17/DI_19 to value the maximum injection current specification.
  3. Maximum allowable current is a function of device maximum power dissipation (See Thermal Operating Conditions).
  4. For a list of High Sink I/O pins, refer to the I/O Pin Electrical Specifications.