46.19 ADC

Table 46-25. ADC Accuracy Specifications
Operating Conditions:
  • VDD = 3.0V
  • TA = 25°C
  • VADCREF = 3.0V
  • fCLK_ADC = 500 kHz
SymbolDescriptionMin.Typ. ✝Max.UnitsConditions
NRResolution -- 10bit
EINLIntegral nonlinearity error-0.1-LSb
EDNLDifferential nonlinearity error(1)-0.1-LSb
EOFFOffset error-0.5-LSb
EGAINGain error-0.2-LSb
EABSAbsolute error- 0.8-LSb
VADCREF *ADC reference voltage1 -VDDV
VAINFull-scale rangeGND -VADCREFV
ZAINRecommended impedance of ADC input voltage source -<10 -
RVREFAADC voltage reference ladder resistance(2) -50-
EVDD/10VDD/10 divider (VDDDIV10/VDDIO2DIV10) accuracy-±10-%Measured with ADC using on-chip internal reference

Unless otherwise specified, data in the “Typ.” column is at TA = 25°C and VDD = 3.0V. These parameters are not tested and are for design guidance only.

* These parameters are characterized but not tested in production.

Note:
  1. The ADC conversion result never decreases with an increase in the input and has no missing codes.
  2. This is the resistance seen by the VREFA pin when the external reference is selected.
Table 46-26. ADC Conversion Timing Specifications
Symbol Min.Typ. ✝Max.UnitsConditions
TCLK_ADC *ADC clock period0.5 8µs
tCNVConversion time 11.5×TCLK_ADC + 2×TCLK_PER
fADC *Sample rate8 170ksps
tSENSE *Delay for changing MUXPOS to TEMP 40 µs
tADC_INIT *Initialization time 6 µs

Unless otherwise specified, data in the “Typ.” column is at TA = 25°C and VDD = 3.0V. These parameters are not tested and are for design guidance only.

* These parameters are characterized but not tested in production.