46.8 Memory Programming Specifications

Table 46-7. Memory Programming Specifications
SymbolDescriptionMin.Typ. ✝Max.UnitsConditions
Data EEPROM Memory Specifications
ED*Data EEPROM byte endurance100k--Erase/Write cycles-40°C ≤ TA ≤ +85°C
tD_RETCharacteristic retention-40-Year
VD_RWVDD for Read or Erase/Write operationVDDMIN-VDDMAXV
ND_REF*Total Erase/Write cycles before refresh(2)1M4M-Erase/Write cycles-40°C ≤ TA ≤ +85°C
tD_CEByte/Multibyte/Full EEPROM Erase time-1011.7ms
tD_WREByte Write time-7075µs
tD_BEWByte Erase and Write time-10.07-ms
Program Flash Memory Specifications
EP*Flash memory cell endurance1k--Erase/Write cycles
tP_RETCharacteristic retention-40-Year
VP_RDVDD for Read operationVDDMIN-VDDMAXV
VP_REWVDD for Erase/Write operationVDDMIN (1)-VDDMAXV
tP_CEChip Erase time-11-ms
tP_PEPage Erase time-10-ms
tP_WRDByte/Word Write time-70-µs

Unless otherwise specified, data in the “Typ.” column is at TA = 25°C and VDD = 3.0V. These parameters are not tested and are for design guidance only.

* These parameters are characterized but not tested in production.

Note:
  1. During Chip Erase, the Brown-out Detector (BOD) configured with BODLEVEL0 is forced ON. The erase attempt will fail if the supply voltage VDD is below VBOD for BODLEVEL0.
  2. The number of times a separate location may be erased/written before a full refresh (erase/write) of the EEPROM array is required.