48.1 Revision History

Revision K - March 2025

SectionDescription
Ordering Information
  • Updated the Diagram to reflect the addition of OTP
SYSCTRL
USB
  • Corrected verbiage in the Register description for the EPINTENSETn Register
Electrical Characteristics at 85°C
Electrical Characteristics at 105°C
Electrical Characteristics at 125°C
AEC-Q100 125°C Specifications
Schematic Checklist

Revision J - December 2024

Internal engineering updates. Non-public release.

Revision H - September 2021

SectionDescription
SYSCTRLRemoved erroneous text from the DFLLRDY bitfield of the PCLKSR Register.
DMACRemoved non-applicable text from Burst Transfer in DMA.
TCCUpdated the number of TCC Instances in Overview.
ADCUpdated the Equations in Prescaler for Single-Shot and Free-Running Modes.
ACAdded a new paragraph to Overview for L-Variant devices.
DACUpdated Synchronization to reflect that no bits need synchronization.
Electrical Characteristics at 85°C
SAM DA1 Electrical Characteristics at 105°CUpdated the values in the BOD33 LEVEL Value table in BOD33.
Appendix BUpdated Ordering Information with a new table reflecting all ISELED parts.
Packaging InformationUpdated the following packages with a new note:
Added the following package:

Revision G - April 2021

This revision includes the updates as listed in the following table, and numerous typographical corrections throughout the document.

SectionDescription
GeneralThe SPI, I2S, and I2C standards use the terminology "Master" and "Slave". The equivalent Microchip terminology used in this document is "Host" and "Client" respectively.

These terms have been updated throughout this document for this revision.

FeaturesUpdated RWW to RWWEE for Memories
Ordering InformationUpdated RWW to RWWEE in the Device Variant description
PinoutUpdated the following Pinouts to accurately display the RESET pin
I/O Multiplexing
Product MappingUpdated RWW to RWWEE in the figure
Memories
Processor and Architecture
DSU
Clock SystemUpdated Read Request with new verbiage for the READREQ.RCONT and READREQ.RREQ bits
GCLKUpdated the GENDIV Register with a new Register property, and added a new column for the Maximum Division Factor to the table for the DIV bit.
SYSCTRL
  • Updated the following registers:
    • XOSC with new verbiage for the AMPGC and GAIN bits
    • DFLLCTRL - removed erroneous RUNSTDBY bit
RTCUpdated the Overview with new verbiage for clock sources selectable through the GCLK.
DMAC
  • Updated the following registers:
    • BASEADDR with new text for the bitfield BASEADDR
    • WRBADDR with new text for the bitfield WRBADDR
    • SRCADDR with new text for the bitfield SRCADDR
    • DSTADDR with new text for the bitfield DSTADDR
    • DESCADDR bitfield was updated for 64 bit alignment in the DESCADDR register
EICUpdated the EXTINTx bit of the INTENCLR register to read “disables the external interrupt.”
NVMCTRL
  • Updated the Overview with new text for the EEPROM Emulation array
  • Updated Memory Organization with new EEPROM Emulation verbiage
  • Updated NVM User Configuration with new EEPROM Emulation verbiage
  • Updated the following registers:
    • PARAM
    • The ADDR bit of the ADDR Register was updated with new verbiage
    • The LOCK bit of the LOCK Register was updated with the correct reset value
EVSYS
  • Updated Features with new event user verbiage
  • Updated the CHSTATUS Register with a new Reset value for the USRRDY bitfield
SERCOM I2C
  • Updated the Signal Description with a cross reference to the proper I/O Multiplexing table
  • In DMA, Interrupts and Events, erroneous information referring to the TX FIFO and RX FIFO was removed from table 28-1 and table 28-2
  • In Interrupts erroneous information regarding the RX FIFO and TX FIFO was removed
  • Updated the SYNCBUSY Register to remove the SYSOP bitfield
  • Updated the DATA Register with a new register Property and added a note to the DATA Bitfield
I2SAdded new slotsize information to PDM Reception.
TCUpdated the RCONT bit of the READREQ Register with new verbiage for clearing and reading the RREQ and RCONT bits.
USBUpdated the SPEED Bitfield of the STATUS Register with the proper allocation of low-speed and full-speed mode.
ADC
  • Updated the Block Diagram to properly display INTVCC0/1, and updated the note
  • Updated the Note for the REFSEL bit of the REFCTRL Register
DACUpdated the CTRLB Register with a new note for the REFSEL bitfield.
Electrical Characteristics at 85°C
Electrical Characteristics at 105°C
Electrical Specifications at 125°C
AEC-Q100 125°C Specifications
SAM DA1 Electrical Characteristics
Appendix BAdded a new Appendix for ISELED Specifications.
PackagingThe following packages were updated with new drawings:

Revision F - March 2020

This revision includes the updates as listed in the following table, and several typographical corrections throughout the document.

SectionDescription
Appendix AAdded a new appendix SIL 2 Enabled Functional Safety Devices
Packaging InformationAdded ‘35-ball WLCSP (Device variant D)’
DAC
  • Updated the INTENSET register, changed disable to enable for interrupts.
  • Updated the SYNCRDY bit of the INTENSET Register.

    Added information about internal 1.0V buffered reference voltage.

ADC

Added information about internal 1.0V buffered reference voltage.

Updated CALIB register description.

SAM DA1 Electrical CharacteristicsUpdated I2C Pins Characteristics in I2C Configuration in I2C Pins.

Updated label for internal 1.1V Bandgap Reference

Added information about internal 1.0V buffered reference voltage for ADC and DAC.

SERCOM I2CUpdated the SYSOP bit of the SYNCBUSY Register with the removal of erroneous text
SERCOM SPIUpdated DOPO description.
EICNote added for CONFIGn registers.
DMACUpdatetd Sleep mode operation description.
SYSCTRLRemoved reference to BOD12 registers. Added ENABLE bit in the VREG register.
DSURelated linked added in the DID register description.

Revision E - January 2020

This revision encompasses changes made to combine the SAM D21 Data Sheet with the SAM DA1 Data Sheet to improve readability and information access.

SectionDescription
Block DiagramAdded arrow between PORT and AHB-APB BRIDGE B.
PinoutUpdated section titles
Product MappingUpdated the diagram to show the Internal Flash.
PORT I/O Pin ControllerCorrected the WRCONFIG register to show the DRVSTR bit.
SERCOMUnder Clock Generation - Baud-Rate Generator, the table was updated with a new information and equations.
SERCOM USART
  • Information regarding FIFO was removed as it is not supported on this device
  • The FIFOCLR bit was removed from the CTRLB register
  • The FIFOSPACE and FIFOPTR registers were removed
SERCOM SPI
  • Information on FIFO was removed as it is not supported on this device
  • The FIFOCLR bit was removed from the CTRLB register
  • The FIFOSPACE and FIFOPTR registers were removed
SERCOM I2C
  • Information on FIFO was removed as it is not supported on this device
  • The FIFOCLR bit was removed from the CTRLB Slave Register
  • Bit fields RXFF and TXFE were removed from the INTENCLR, INTENSET, and INTFLAG Slave Registers
  • The LENERR bit was removed from the STATUS Slave Register
  • Registers FIFOSPACE and FIFOPTR were removed from the Slave Registers
  • The FIFOCLR bit was removed from the CTRLB Master Register
  • Bit fields, RXFF and TXFE, were removed from the INTENCLR, INTENSET, and INTFLAG Master Registers
  • Registers FIFOSPACE and FIFOPTR were removed from the Master Registers
Timer Counter (TC)
TCC
  • FCTRLA and FCTRLB had their naming corrected
  • In the WEXCTRL register the DTIEN bit had the numbering updated
  • In the DRVCTRL register the numbering was updated for the INVENx, NRVx, and NREx bits
  • In the EVCTRL register the numbering was updated for the MCEOx, MCEIx, TCEIx, and TCINVx Registers
  • In the INTENCLR, INTENSET, and INTFLAG registers the numbering was updated for the MCx bit
  • In the STATUS register the numbering was updated for the CMPx and FAULTx bits
  • The PATT register was updated to properly display the PGVx and PGEx bits
  • The PATTB register was updated to properly display the PGVBx and PGEBx bits
USBUpdated cross references.
ADCUpdated the MUXPOS Bit table in the INPUTCTRL register.
AC
  • Updated the STARTx bit numbering in the CTRLB register
  • Updated the bit numbering for the COMPEIx, COMPEOx, and WINEOx bits in the EVCTRL register
  • Updated the bit numbering for the WINx, and COMPx bits in the INTENCLR, INTENSET, and INTFLAG registers
  • Updated the bit numbering for the WSTATEx and STATEx bits in the STATUSA register
  • Updated the bit numbering for the READYx bit in the STATUSB register
  • Updated the bit numbering for the WSTATEx and STATEx bits in the STATUSC register
  • Updated the bit numbering for the WINTSELx and WENx bits in the WINCTRL register
SAM DA1 Electrical CharacteristicsThis section was migrated into this data sheet from the original SAM DA1 data sheet.
Schematic ChecklistUpdated External Reset Circuit with changes to the diagram External Reset Circuit Schematic.
Packaging InformationUpdated Package Markings with a new marking diagram.

Rev D - 9/2018

Configuration SummaryUpdated to Add new packages for device variant D.
Product MappingUpdated diagram.
RTCUpdated READREQ register tables.
DMACUpdated Channel Control B Register tables.
EVSYS – Event System
  • Updated the Channel Register tables
  • Updated the User Register tables
DACUpdated the Block Diagram to display ADC Input.
Electrical Characteristics at 85°C
  • Updated Decoupling Requirements table
.
Electrical Characteristics at 105°C
Electrical Characteristics at 125°C
AEC-Q100 Electrical Characteristics at 125°C
Packaging InformationUpdated the WLSCP 45-Ball Package diagram.

Rev. C – 06/2018

Features
  • Added Qualification AEC-Q100 Grade 1 (-40C to 125C).
Ordering Information
  • Added: under Package Grade Z = -40 – 125C Matte Sn Plating AEC-Q100
Electrical Characteristics
  • Updated with new chapter for AEC-Q100 Specifications.
Packaging Information
  • Added QFN package drawings with wettable flanks.

Rev. B – 04/2018

General
  • This revision was updated to include the SAM D21EL and SAM D21GL Variant information, which was released separately in DS40001883A. The SAM D21EL/SAM D21GL Data Sheet (DS40001883A) is superseded by this revision (DS40001882B).
  • IOBUS start addressed is added which was missing in previous revision (DS40001882A).
Electrical Characteristics
  • Clarified ESR information for VDDCORE capacitor
  • Typo addressed for VDDIN capacitor value
DMA
  • RUNSTDBY not supported, typo addressed
AC
  • Continuous Mode SleepWalking figure is updated
ADC
  • Bandgap reference as input was omitted in previous version of the data sheet. It is added in this version.
Packaging Information
  • WLCSP package drawings updated
  • Thermal characteristic for 45-ball WLCSP & 64-pin UFBGA is added

Rev. A – 01/2017

General
  • Template: Updated from Atmel to Microchip template.
  • Document number: Changed from the Atmel 42181 to Microchip xxxxx.
  • Document revision letter reset to A.
  • ISBN number added.
Electrical Characteristics
Errata
  • New errata added:
    • B
    • Device Variant A: Errata reverence 15625, 15683, 15753 added.
    • Device Variant B: Errata reverence 15625, 15683, 15753 added.
    • Device Variant C: Errata reverence 15625, 15683, 15753 added.
Electrical Characteristics at 125°C