49.3 Power Supply
DC CHARACTERISTICS | Standard
Operating Conditions: VDD=AVDD = 1.62V to 3.63V (unless otherwise
stated) Operating temperature: -40°C ≤ TA ≤ +85°C for Industrial | |||||||
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Param. No. | Symbol | Characteristics | Min. | Typ. | Max. | Units | Conditions | |
REG_1 | VDDCORE_CIN (5) | VDDCORE Input Bypass parallel Capacitor pair | 0.8 | 1 | 1.2 | µF | Bulk Ceramic or solid Tantalum with ESR <0.5Ω | |
80 | 100 | — | nF | Ceramic XR7 with ESR <0.5Ω | ||||
REG_3 | VDDPLL_CIN (5) | VDDPLL Input Bypass parallel Capacitor pair | 0.8 | 1 | 1.2 | µF | Bulk Ceramic or solid Tantalum with ESR <0.5Ω | |
80 | 100 | — | nF | Ceramic XR7 with ESR <0.5Ω | ||||
REG_5 | VDD_CIN (5) | VDD Input Bypass parallel Capacitor pair | 80 | 100 | — | nF | Ceramic XR7 with ESR <0.5Ω on all VDD pins | |
REG_9 | VREFx_CIN (5) | External VREFA/VREFB Input Bypass parallel Capacitor pair | 3.76 | 4.7 | — | µF | Bulk Ceramic or solid Tantalum with ESR <0.5Ω | |
80 | 100 | — | nF | Ceramic XR7 with ESR <0.5Ω | ||||
REG_17 | AVDD_CIN (5) | AVDD Input Bypass parallel Capacitor pair | 8 | 10 | — | µF | Bulk Ceramic or solid Tantalum with ESR <0.5Ω | |
80 | 100 | — | nF | Ceramic XR7 with ESR <0.5Ω on all AVDD pins | ||||
REG_23 | AVDD_LEXT (1) | AVDD series Ferrite Bead DCR (DC Resistance) | — | — | 0.1 | Ω | ≥ 600 Ohms @ 100MHz | |
REG_25 | Ferrite Bead Current Rating | 500 | — | — | mA | — | ||
REG_27 | VDDOUT_LEXT (2,3) | Buck Switch Mode Regulator Inductor Inductance (If LDO Mode not used) | 8 | 10 | 12 | µH | Shielded Inductor ONLY (If used in BUCK mode else No Connect) | |
REG_29 | Inductor DCR (DC Resistance) | — | — | 0.7 | Ω | — | ||
REG_31 | Inductor ISAT Rating | 275 | — | — | mA | — | ||
REG_33 | BUCK_PEFF | Buck Mode Power Efficiency | — | 86 | — | % | IOUT = 5mA | |
REG_35 | — | 85 | — | % | IOUT = 50mA | |||
REG_36 | VDDCORE |
VDDCORE Voltage Range (PL0 mode) | — | 0.9 | — | V | CPU in Active or Idle Mode | |
VDDCORE Voltage Range (PL2 mode) | — | 1.2 | — | |||||
REG_36A | VSCALING_STEP | VDDCORE / VDDPLL Voltage Scaling Step Size | — | 5 | — | mV | Step size for PL0 to PL2 (or PL2 to PL0) transition | |
REG_37 | VDD (4) | VDD Input Voltage Range | 1.62 | 3.3 | 3.63 | V | PIC32CM LE00 / PIC32CM LS00 | |
2.0 | PIC32CM LS60 | |||||||
REG_38 | VDDPLL | VDDPLL
Voltage Range (PL0 mode) | — | 0.9 | — | V | CPU in Active or Idle Mode | |
VDDPLL
Voltage Range (PL2 mode) | — | 1.2 | — | |||||
REG_39 | AVDD (4) | AVDD Input Voltage Range | 1.62 | 3.3 | 3.63 | V | PIC32CM LE00 / PIC32CM LS00 | |
2.0 | PIC32CM LS60 | |||||||
REG_43 | SVDD_R | VDD/AVDD Rise Ramp Rate to ensure internal Power-on Reset Signal | — | — | 0.1 | V/µs | Failure to meet this specification may lead to start-up or unexpected behaviors | |
REG_44 | SVDD_F | VDD/AVDD Falling Ramp Rate to ensure internal Power-on Reset Signal | — | — | 0.05 | V/µs | Failure to meet this specification may cause the device to not detect reset | |
REG_45 | VPOR | Power-on Reset | 0.6 | — | 1.63 | V | VDD/AVDD Power up/Down | |
REG_47 | VBOD33 (6,7) |
BOD33.VREFSEL=0 | 1.57 | — | 1.60 | V | BOD33.LEVEL = 0x4 (Default Factory Value) | |
3.60 | — | 3.68 | BOD33.LEVEL = 0x3F | |||||
BOD33.VREFSEL=1 | 1.64 | — | 1.79 | BOD33.LEVEL = 0x11 | ||||
2.91 | — | 3.18 | BOD33.LEVEL = 0x3F | |||||
REG_51 | VBOD33LEVEL_STEP | VBOD33 step size (BOD33.LEVEL) | BOD33.VREFSEL=0 | — | 34 | — | mV | Step size |
BOD33.VREFSEL=1 | — | 28 | — | |||||
REG_52 | VBOD33HYST_STEP | VBOD33 Hysteresis step size (BOD33.HYST) | — | Note (7) | — | mV | Step size | |
REG_53 | TRST | External RESET valid active pulse width | 1 | — | — | µs | Minimum reset active time to guarantee CPU reset | |
Note:
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