48.2 CPU Electrical Characteristics

Table 48-3. Operating Frequency Versus Voltage
Param. No.VDDIO, AVDD RangeVDDREG RangeTemp. Range (in °C)Max CPU FrequencyComments
DC_51.75V to 3.63V1.75 - 1.85v-40°C to +85°C300 MHzIndustrial
Table 48-4. CPU Thermal Operating Conditions
RatingSymbolMin.Typ.Max.Unit
Industrial Temperature Devices

Operating Ambient Temperature Range

Operating Junction Temperature Range

TA

TJ

-40

-40

—85

105

°C
Power Dissipation:

Internal Chip Power Dissipation:

PINT = (VDDIO x (IDD –∑ IOHVDDIO)) + (VUSB3V3 x IDDUSB) + (AVDD x (IDDANA - ∑ IOHAVDD)) + (VDDREG x IDDREG)

I/O Pin Power Dissipation:

PI/O = ∑ ((VDDIO – VOHVDDIO) x IOHVDDIO) + ∑ (VOL x IOLVDDIO) + ∑ ((AVDD – VOHAVDD) x IOHAVDD) + ∑ (VOL x IOLAVDD)

PDPINT + PI/OW
Maximum Allowed Power DissipationPDMAX(TJ – TA)/θJAW
Table 48-5. Thermal Packaging Characteristics
CharacteristicsSymbolTyp.Max.UnitComments
Thermal Resistance, 144-Pin TFBGA (12x12x1.19 mm ) PackageθJA23.052—°C/W(Note 1)
Thermal Resistance, 176-Pin TFBGA (14x14x1.19 mm ) PackageθJA20.852—°C/W(Note 1)
Thermal Resistance, 208-Pin TFBGA (15x15x1.19 mm ) PackageθJA20.3—°C/W(Note 1)
Note:
  1. Junction to ambient thermal resistance, Theta-JA (θJA) numbers are achieved by package simulations.