48.3 Power Supply

Table 48-6. Power Supply DC Electrical Specifications
DC CHARACTERISTICSStandard Operating Conditions: VDDIO = AVDD 1.75V to 3.63V, VDDREG = 1.75V to 1.85V (unless otherwise stated)

Operating temperature:

-40°C ≤ TA ≤ +85°C for Industrial

Param. No.SymbolCharacteristicsMin.TypicalMax.UnitsConditions
REG_5VDDIO_CINVDDIO Input Bypass parallel Capacitor pair (3)33µFBulk Ceramic or solid Tantalum with ESR <0.5Ω (3)
100nFCeramic X7R with ESR <0.5Ω on all VDDIOx pins (3)
REG_6VDDREG_CINVDDREG Input Bypass parallel Capacitor pair (3)33µFBulk Ceramic or solid Tantalum with ESR <0.5Ω (3)
100nFCeramic X7R with ESR <0.5Ω on all VDDIOx pins (3)
REG_10VDDUSB_CINUSB Power pin bypass capacitance (3)4.7µFRequired VUSB3V3 power pin parallel bypass capacitors
0.1µF
REG_17AVDD_CINAVDD Input Bypass parallel Capacitor pair (3)10µFBulk Ceramic or solid Tantalum with ESR <0.5Ω
100nFCeramic X7R with ESR <0.5Ω
REG_23AVDD_LEXTAVDD series Ferrite Bead DCR (DC Resistance)0.15≥1kΩ @ 100 MHz
REG_25Ferrite Bead current Rating500mA
REG_37VDDIO (2)VDDIO Input Voltage Range1.753.33.63V
REG_39AVDD (2)AVDD Input Voltage Range1.753.33.63V
REG_40VDDREGVDDREG Input Voltage Range1.751.81.85V
REG_42VUSB3V3VUSB3V3 Input Voltage Range33.6V
REG_42AIDDUSBVUSB3V3 max current8mA
REG_43SVDDIO_RVDDIO Rise Ramp Rate to Ensure Internal Power-on Reset Signal3.3 x 10(-7)0.18V/µsFailure to meet this specification may lead to start-up or unexpected behaviors
REG_45VP0RPower-on Reset 1.4471.573VVDDIO Power-up/Power-down

(See Param REG43, VDDIO Ramp Rate)

REG_47VDDIO BORVDDIO BOR1.641.67VBOR_TRIP_VDDIO = 0x0

HYST_BOR_VDDIO = 0x0

2.132.16VBOR_TRIP_VDDIO = 0x1

HYST_BOR_VDDIO = 0x0

2.512.55VBOR_TRIP_VDDIO = 0x2

HYST_BOR_VDDIO = 0x0

2.762.83VBOR_TRIP_VDDIO = 0x3

HYST_BOR_VDDIO = 0x0

1.631.65VBOR_TRIP_VDDIO = 0x0

HYST_BOR_VDDIO = 0x1

2.072.11VBOR_TRIP_VDDIO = 0x1

HYST_BOR_VDDIO = 0x1

2.442.47VBOR_TRIP_VDDIO = 0x2

HYST_BOR_VDDIO = 0x1

2.662.68VBOR_TRIP_VDDIO = 0x3

HYST_BOR_VDDIO = 0x1

REG_48AVDD BORAVDD BOR1.641.67VBOR_TRIP_VDDA = 0x0

HYST_BOR_VDDA = 0x0

2.132.16VBOR_TRIP_VDDA = 0x1

HYST_BOR_VDDA = 0x0

2.512.55VBOR_TRIP_VDDA = 0x2

HYST_BOR_VDDA = 0x0

2.762.83VBOR_TRIP_VDDA = 0x3

HYST_BOR_VDDA = 0x0

1.631.65VBOR_TRIP_VDDA = 0x0

HYST_BOR_VDDA = 0x1

2.072.11VBOR_TRIP_VDDA = 0x1

HYST_BOR_VDDA = 0x1

2.442.47VBOR_TRIP_VDDA = 0x2

HYST_BOR_VDDA = 0x1

2.662.68VBOR_TRIP_VDDA = 0x3

HYST_BOR_VDDA = 0x1

REG_49VDDREG BORVDDREG BOR1.621.68VHYST_BOR_VDDREG = 0x0
1.621.68VHYST_BOR_VDDREG = 0x1
REG_50VDDUSB BORVDDUSB BOR2.812.85V
REG_53TRSTExternal RESET valid active pulse width2µsMinimum reset active time to guarantee MCU reset
Note:
  1. Ferrite Bead ISAT(min) ≥ (IDDANA(max) * 1.15).
  2. VDDIO and AVDD must be at the same voltage level.
  3. All bypass caps should be located immediately adjacent to pins and on the same side of the PCB as the MCU, or in the case of BGA packages, directly below the power pads and direct adjacent to the fan-out vias. Each primary power supply group VDDIO, and AVDD, should have one bulk capacitor and all power pins everywhere a 100 nf bypass cap.