49.3 Thermal Specifications

Table 49-3. Thermal Operating Conditions
RatingSymbolMin.TypMax.Unit
Industrial Temperature Devices:
Operating ambient temperature rangeTA-40—+85°C
Operating junction temperature rangeTJ——+95°C
V-temp Temperature Devices:
Operating ambient temperature rangeTA-40—+105°C
Operating junction temperature rangeTJ——+115°C
Extended Temperature Range:
Operating ambient temperature rangeTA-40—+125°C
Operating junction temperature rangeTJ——+135°C

Power Dissipation:

Internal Chip Power Dissipation:

PINT = (VDDIOx x (IDD –∑ IOH))

I/O Pin Power Dissipation:

PI/O = ∑ (({VDDIO – VOH} x IOH) + ∑ (VOL x IOL))

PDPINT + PI/OW
Maximum allowed power dissipationPDMAX(TJ – TA)/ϴJAW
Table 49-4. Thermal Packaging Characteristics
CharacteristicsSymbolTypMax.Unit
Thermal Resistance, 132-pin DQFN (10 mm x 10 mm x 0.9 mm) PackageϴJA21.7—°C/W
Note: The junction-to-ambient thermal resistance, ϴJA, numbers are achieved by package simulations.