43.2 Power Supply
DC CHARACTERISTICS | Standard
Operating Conditions: VDD and VDDIO 2.7V to 5.5V (unless otherwise
stated) Operating temperature: -40°C ≤ TA ≤ +85°C for Industrial |
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Param. No. | Symbol | Characteristics | Min. | Typical | Max. | Units | Conditions |
REG_1 | VDDCORE_CIN | VDDCORE Input Bypass parallel Capacitor pair | 0.8 | 1 | 1.2 | µF | Bulk Ceramic or solid Tantalum with ESR <0.5Ω (Immediately adjacent to pin) |
REG_3 | 80 | 100 | — | nF | Ceramic XR7 with ESR <0.5Ω (Immediately adjacent to pin) | ||
REG_4 | VDDIO_CIN | VDDIO Input Bypass parallel Capacitor pair | 8 | 10(5) | — | µF | Bulk Ceramic or solid Tantalum with ESR <0.5Ω (1,6) |
REG_5 | 80 | 100 | — | nF | Ceramic XR7 with ESR <0.5Ω (Immediately adjacent to all VDDIO pins)(6) | ||
REG_7 | VDDIN_CIN | VDDIN Input Bypass parallel Capacitor pair | 8 | 10(6) | — | µF | Bulk Ceramic or solid Tantalum with ESR <0.5Ω (1) |
REG_8 | 80 | 100 | — | nF | Ceramic XR7 with ESR <0.5Ω (Immediately adjacent to all VDDIN pins) | ||
REG_9 | VREFx_CIN | External VREFx Input Bypass parallel Capacitor pair (7) | 3.76 | 4.7 | — | µF | Bulk Ceramic or solid Tantalum with ESR <0.5Ω (6) |
REG_11 | 80 | 100 | — | nF | Ceramic XR7 with ESR <0.5Ω (Immediately adjacent to pin)(6) | ||
REG_17 | VDDANA_CIN | VDDANA Input Bypass parallel Capacitor pair | 8 | 10 | — | µF | Bulk Ceramic or solid Tantalum with ESR <0.5Ω (1,6) (as close as possible to pin) |
REG_19 | 80 | 100 | — | nf | Ceramic XR7 with ESR <0.5Ω (Immediately adjacent to pin)(6) | ||
REG_23 | VDDANA_LEXT | VDDANA series Ferrite Bead DCR (DC Resistance) | — | — | 0.1 | Ω | ≥600 Ohms @ 100 MHz |
REG_25 | Ferrite Bead current rating | 500 | — | — | mA | ||
REG_37 | VDDIO, VDDIN, VDDANA (2) | VDDIO, VDDIN, VDDANA Input Voltage Range | 2.7 | — | 5.5 | V | — |
REG_38 | IVDDIO_MAX | VDDIO max current | — | — | 92 | mA | I/O pin configured as inputs |
REG_39 | VDDCORE | DC calibrated output voltage | 1.08 | 1.23 | 1.32 | V | — |
REG_41A | IVDDCORE_MAX | VDDCORE max current | — | — | 2.3 | mA | LDO mode |
REG_41B | — | — | 302 | µa | Standby mode | ||
REG_43 | SVDDIO/VDD_R | VDDIN, VDDANA, VDDIO Rise Ramp Rate to Ensure Internal Power-on Reset Signal | — | — | 0.1 | V/µs | Failure to meet this specification may lead to start-up or unexpected behaviors |
REG_44 | SVDDIO/VDD_F | VDDIO Falling Ramp Rate to Ensure Internal Power-on Reset Signal | — | — | 0.05 | V/µs | Failure to meet this specification may cause the device to not detect reset |
REG_45A | VPOR+ | VDDIO/VDD Rising Power-on Reset | 2.49 | — | 2.58 | V | VDDIO Power- up power -down (See Param REG_43, VDDIO/VDD Ramp Rate) |
REG_45B | VPOR- | VDDIO/VDD Falling Power-on Reset | 1.64 | — | 1.92 | V | VDDIO Power- up or Power-down (See Param REG_43, VDDIO/VDD Ramp Rate) |
REG_47 | VBODVDD | VDDIO BOD (All modes) | 2.74 | 2.80 | 2.86 | V | (Default Setting) LEVEL[5:0] = 0x8 (3) HYST[0] = 0x0 |
2.74 | 2.86 | 2.91 | V | (Default Setting) LEVEL[5:0] = 0x8 (3,4) HYST[0] = 0x1 | |||
5.27 | 5.41 | 5.48 | V | LEVEL[5:0] = 0x3F (3) HYST[0] = 0x0 | |||
5.27 | 5.50 | 5.57 | V | LEVEL[5:0] = 0x3F (3,4) HYST[0] = 0x1 | |||
REG_51 | VBODVDDLEVEL_STEP | VBODVDD step size, LEVEL[5:0] | — | 47 | — | mV | — |
REG_52 | VBODVDDHYST_STEP | VBODVDD Hysterisis | — | See note (4) | — | — | — |
REG_53 | TRST | External RESET valid active pulse width | 1.1 | — | — | µs | Minimum reset active time to guarantee CPU reset |
Note:
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