43.1 Operating Frequencies and Thermal Limitations

Table 43-2. Operating Frequency vs. Voltage
Param. No. VDDIO, VDDIN, VDDANA Range Temp. Range (in °C) Max CPU Frequency Comments
DC_5 2.7 to 5.5V(1,2,3) -40°C to +85°C 48 Mhz Industrial
Note:
  1. With BODVDD disabled.
  2. The same voltage must be applied to VDDIN and VDDANA. This common voltage is referred to as VDD in the data sheet. VDDIO should be lower or equal to VDD = VDDIN = VDDANA.
  3. Some I/Os are in the VDDIO cluster, but can be multiplexed as analog functions (inputs or outputs). In such a case, VDDANA is used to power the I/O. Using this configuration may result in an electrical conflict if the VDDIO voltage is lower than VDD = VDDIN = VDDANA.
Table 43-3. Thermal Operating Conditions
Rating Symbol Min. Typ. Max. Unit
Operating Ambient Temperature Range TA -40 — 85 °C
Operating Junction Temperature Range TJ — — (1) °C
Power Dissipation:

Internal Chip Power Dissipation:

PINT = (VDD x (IDD - Σ IOHVDD)) + VDDIO x (IDDIO - Σ IOHVDDIO)

I/O Pin Power Dissipation:

PI/O = Σ ({VDD - VOH} x IOHVDD) + Σ (VOL x IOLVDD) + Σ ({VDDIO - VOH} x IOHVDDIO) + Σ (VOL x IOLVDDIO)

 PD PINT + PI/O W
Maximum Allowed Power Dissipation PDMAX (TJ – TA)/θJA W
Note:
  1. See Absolute Maximum Ratings.
Table 43-4. Thermal Packaging Characteristics
Characteristics Symbol Typ. Max. Unit Comments
Thermal Resistance, 32-pin TQFP (7x7x1 mm) Package θJA 63.1 — °C/W Note (1)
Thermal Resistance, 48-pin TQFP (7x7x1 mm) Package θJA 62.7 — °C/W
Thermal Resistance, 32-pin VQFN (5x5x0.9 mm) Package θJA 40.5 — °C/W
Thermal Resistance, 48-pin VQFN (7x7x0.9 mm) Package θJA 30.9 — °C/W
Note:
  1. Junction to ambient thermal resistance, Theta-JA (θJA) numbers are achieved by package simulations.