43.1 Operating Frequencies and Thermal Limitations

Table 43-2. Operating Frequency vs. Voltage
Param. No.	VDDIO, VDDIN, VDDANA Range	Temp. Range (in °C)	Max CPU Frequency	Comments
DC_5	2.7 to 5.5V^(1,2,3)	-40°C to +85°C	48 Mhz	Industrial

Note:

With BODVDD disabled.
The same voltage must be applied to VDDIN and VDDANA. This common voltage is referred to as VDD in the data sheet. VDDIO should be lower or equal to VDD = VDDIN = VDDANA.
Some I/Os are in the VDDIO cluster, but can be multiplexed as analog functions (inputs or outputs). In such a case, VDDANA is used to power the I/O. Using this configuration may result in an electrical conflict if the VDDIO voltage is lower than VDD = VDDIN = VDDANA.

Table 43-3. Thermal Operating Conditions
Rating	Symbol	Min.	Typ.	Max.	Unit
Operating Ambient Temperature Range	TA	-40	—	85	°C
Operating Junction Temperature Range	TJ	—	—	(1)	°C
Power Dissipation: Internal Chip Power Dissipation: P_INT = (VDD x (IDD - Σ IOHVDD)) + VDDIO x (IDDIO - Σ IOHVDDIO) I/O Pin Power Dissipation: PI/O = Σ ({VDD - VOH} x IOHVDD) + Σ (VOL x IOLVDD) + Σ ({VDDIO - VOH} x IOHVDDIO) + Σ (VOL x IOLVDDIO)	PD	PINT + PI/O			W
Maximum Allowed Power Dissipation	PDMAX	(TJ – TA)/θJA			W

Note:

Table 43-4. Thermal Packaging Characteristics
Characteristics	Symbol	Typ.	Max.	Unit	Comments
Thermal Resistance, 32-pin TQFP (7x7x1 mm) Package	θJA	63.1	—	°C/W	Note (1)
Thermal Resistance, 48-pin TQFP (7x7x1 mm) Package	θJA	62.7	—	°C/W
Thermal Resistance, 32-pin VQFN (5x5x0.9 mm) Package	θJA	40.5	—	°C/W
Thermal Resistance, 48-pin VQFN (7x7x0.9 mm) Package	θJA	30.9	—	°C/W

Note:

Junction to ambient thermal resistance, Theta-JA (θJA) numbers are achieved by package simulations.