43.5 CPU Standby Power

Table 43-8. CPU Standby Current Consumption Electrical Specifications
DC CHARACTERISTICS Standard Operating Conditions: VDD and VDDIO 2.7V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
Param. No. Symbol Characteristics VDD = VDDIO Typ.(1) Max. Units Conditions
SPWR_1 IDD_STANDBY(2) CPU IDD in Standby mode XOSC32K running

RTC running at 1 kHz

 5.0V 15.1 585.5 µA SRAM in Back Bias mode (PM.STDBYCFG.BBIASHS = 0x1),

Low-Power regulator is used (PM.STDBYCFG.VREGSMODE = 0x2)
SPWR_3 3.3V 13.7 574.3 µA
SPWR_5 5.0V 60.9 650.3 µA SRAM in Back Bias mode (PM.STDBYCFG.BBIASHS = 0x1),

Main Regulator used (PM.STDBYCFG.VREGSMODE = 0x1)
SPWR_7 3.3V 57.2 645.1 µA
SPWR_9 5.0V 16 694.2 µA SRAM in No Back Bias mode (PM.STDBYCFG.BBIASHS = 0x0),

Low- Power regulator is used (PM.STDBYCFG.VREGSMODE = 0x2)
SPWR_11 3.3V 14.5 681.4 µA
SPWR_13 5.0V 61.9 765 µA SRAM in No Back Bias mode (PM.STDBYCFG.BBIASHS = 0x0),

Main Regulator used (PM.STDBYCFG.VREGSMODE = 0x1)
SPWR_15 3.3V 58.3 759.3 µA
SPWR_29 CPU IDD in Standby mode XOSC32K stopped

RTC stopped

 5.0V 13.6 580.1 µA SRAM in Back Bias mode (PM.STDBYCFG.BBIASHS = 0x1),

Low- Power regulator is used (PM.STDBYCFG.VREGSMODE = 0x2)
SPWR_31 3.3V 12.6 569.4 µA
SPWR_33 5.0V 59.3 642.5 µA SRAM in Back Bias mode (PM.STDBYCFG.BBIASHS = 0x1),

Main Regulator is used (PM.STDBYCFG.VREGSMODE = 0x1)
SPWR_35 3.3V 56.2 636.5 µA
SPWR_37 5.0V 14.4 690 µA SRAM in No Back Bias mode (PM.STDBYCFG.BBIASHS = 0x0),

Low Power regulator used (PM.STDBYCFG.VREGSMODE = 0x2)
SPWR_39 3.3V 13.5 677.6 µA
SPWR_41 5.0V 60.3 760 µA SRAM in No Back Bias mode (PM.STDBYCFG.BBIASHS = 0x0),

Main Regulator used (PM.STDBYCFG.VREGSMODE = 0x1)
SPWR_43 3.3V 57.2 754.3 µA
Note:
  1. Typical values at 25°C only.
  2. Conditions:
    • System in standby mode
    • No SleepWalking (except RTC when indicated)
    • Peripheral modules are inactive (except RTC when indicated)
    • All clocks stopped (CPU, AHB, APB, Main, GCLK, except RTC running at 1 KHz from XOSC32K when indicated)
    • All clock generation sources disabled except XOSC32K running with external 32 kHz crystal when indicated
    • All I/O pins configured as input pins pulled down or tied to GND
    • WDT, CFD Clock Fail Detect disabled
    • BODVDD disabled
    • RESET = VDDIO.
Figure 43-3. Power Consumption Over Temperature in Standby Sleep Mode with RTC
Operating Conditions:
  • VDD = VDDIO = 5.0V