43.22 Serial Peripheral Interface (SERCOM SPI) Mode Electrical Specifications

Figure 43-6. SERCOMx SPI Host Module CPHA=0 AC Timing Diagrams
Figure 43-7. SERCOMx SPI Host Module CPHA=1 AC Timing Diagrams
Table 43-31. SPIx Module Host Mode Electrical Specifications (1)
AC CHARACTERISTICS Standard Operating Conditions: VDD and VDDIO 2.7V to 5.5V (unless otherwise stated)

Operating temperature: -40°C ≤ TA ≤ +85°C for Industrial
Param. No. Symbol Characteristics(1) Min. Typical Max. Units Conditions
MSP_1 FSCK SCK Frequency — — 11.8 MHz Transmitter mode, CTRLB.RXEN=0, CLOAD=30pF(MAX)
— — 3.7 Full Duplex Transmit & Receive mode, CLOAD=30pF(MAX). Loop Back mode with one SPI talking to another SPI on the same MCU.
— — 1/(2*(TMIS+NOTE2_TV)) 2 Full Duplex Transmit & Receive mode, CLOAD=30pf(MAX). The max SPI speed of the MCU is partially dependent on the external SPI device performance characteristics. Faster speeds than the loop back mode above may therefore be possible using the formula.
MSP_3 TSCL SCK Output Low Time 1/(2*FSCK) — — ns —
MSP_5 TSCH SCK Output High Time 1/(2*FSCK) — — ns —
MSP_7 TSCF SCK & MOSI Output Fall Time — — DI_27 ns See parameter DI_27 I/O spec
MSP_9 TSCR SCK & MOSI Output Rise Time — — DI_25 ns See parameter DI_25 I/O spec
MSP_11 TMOV MOSI Data Output Valid after SCK — — 42.3 ns VDDIO = 2.7V, CLOAD = 30pF(MIN)
MSP_13 TMOH MOSI hold after SCK 11.6 — — ns
MSP_15 TMIS MISO Setup Time of Data Input to SCK 62.5 — — ns
MSP_17 TMIH MISO Hold Time of Data Input to SCK 10.6 — — ns
MSP_19 SPI_GCLK SERCOM SPI input clk freq, GCLK_SPI — — 48 MHz
Note:
  1. Assumes VDDIO = 2.7V and 30 pF external load on all SPIx pins unless otherwise noted.
  2. NOTE2_TV is the slave external device data output valid time from clock edge specification.
Figure 43-8. SERCOMx SPI Client Module (CPHA=0) AC Timing Diagram
Figure 43-9. SERCOMx SPI Client Module (CPHA=1) AC Timing Diagram
Table 43-32. SPIx Module Client Mode Electrical Specifications (1)
AC CHARACTERISTICS Standard Operating Conditions: VDD and VDDIO 2.7V to 5.5V (unless otherwise stated)

Operating temperature: -40°C ≤ TA ≤ +85°C for Industrial
Param. No. Symbol Characteristics(1) Min. Typical Max. Units Conditions
SSP_1 FSCK SCK Frequency — — 11.8 MHz Receiver mode, CLOAD= 30 pF (MAX)
— — 3.7 Full Duplex Transmit & Receive mode , CLOAD= 30 pF (MAX). Loop Back mode with one SPI talking to another SPI on the same MCU.
— — 1/(2*(TSOV+NOTE2_TMIS))2 Full Duplex Transmit & Receive mode, CLOAD=30pf(MAX). The max SPI speed of the MCU is partially dependent on the external SPI device performance characteristics. Faster speeds than the loop back mode above may therefore be possible using the formula.
SSP_3 TSCL SCK Output Low Time 1/(2*FSCK) — — ns —
SSP_5 TSCH SCK Output High Time 1/(2*FSCK) — — ns —
SSP_7 TSCF SCK & MISO Output Fall Time — — DI_27 ns See parameter DI_27 I/O spec
SSP_9 TSCR SCK & MISO Output Rise Time — — DI_25 ns See parameter DI_25 I/O spec
SSP_11 TSOV MISO Data Output Valid after SCK — — 80.43 ns VDDIO = 2.7V, CLOAD= 30 pF (MIN)
SSP_13 TSOH MISO hold after SCK 22.3 — — ns
SSP_15 TSIS MOSI Setup Time of Data Input to SCK 14.1 — — ns
SSP_17 TSIH MOSI Hold Time of Data Input to SCK 8.49 — — ns
SSP_19 TSSS SS setup to SCK (PRELOADEN = 1) 2*tck_APB+20.86 — — ns
SS setup to SCK (PRELOADEN = 0) 20.86 — — ns
SSP_21 TSSH SS hold after SCK Client 2.07 — — ns
SSP_23 SPI_GCLK SERCOM SPI input clk freq, GCLK_SPI — — 48 MHz
Note:
  1. Assumes VDDIO = 2.7V and 30 pF external load on all SPIx pins unless otherwise noted.
  2. NOTE2_TMIS is the master external device setup time.