55.2 General Operating Ratings and Thermal Conditions

Table 55-2. Operating Frequency versus Voltage (PIC32CX SG41)
Param. No.VDD, AVDD RangeTemp. Range (in °C)Max CPU FrequencyComments
DC_51.71 to 3.63V-40°C to +85°C120 MHzIndustrial
Note: The same voltage must be applied to VDD and AVDD.
Table 55-3. Operating Frequency versus Voltage (PIC32CX SG60/SG61)
Param. No.VDD, AVDD RangeTemp. Range (in °C)Max CPU FrequencyComments
DC_72.7 to 3.63V-40°C to +85°C120 MHzIndustrial
Note: The same voltage must be applied to VDD and AVDD.
Table 55-4. Thermal Operating Conditions
RatingSymbolMin.Typ.Max.Unit
Extended Temperature Range:

Operating Ambient Temperature Range

Operating Junction Temperature Range

TA

TJ

-40

---

—85

105

°C
Power Dissipation:

Internal Chip Power Dissipation:

PINT = VDD x (IDD –Σ IOHVDD) + AVDD x (IDDANA –Σ IOHAVDD)

I/O Pin Power Dissipation:

PI/O = Σ ((VDD –VOH) x IOHVDD) + Σ (VOL x IOLVDD) + Σ ((AVDD –VOH) x IOHAVDD) + Σ (VOL x IOLAVDD)

PDPINT + PI/OW
Maximum Allowed Power DissipationPDMAX(TJ – TA)/θJAW
Table 55-5. Thermal Packaging Characteristics (PIC32CX SG41) (1)
CharacteristicsSymbolTyp.Max.Unit
Thermal Resistance, 64-pin TQFP (10x10x1.0 mm) PackageθJA57.4—°C/W
Thermal Resistance, 100-pin TQFP (14x14x1.0 mm) Package41.11—
Thermal Resistance, 128-pin TQFP (14x14x1.0 mm) Package34.45—
Note:
  1. Junction to ambient thermal resistance, Theta-JA (θJA) numbers are achieved by package simulations.
Table 55-6. Thermal Packaging Characteristics (PIC32CX SG60/SG61) (1)
CharacteristicsSymbolTyp.Max.Unit
Thermal Resistance, 100-pin TQFP with exposed pad (14x14x1.0 mm) PackageθJA32.67—°C/W
Thermal Resistance, 100-pin TFBGA (9x9x1.2 mm) Package25.76—
Thermal Resistance, 128-pin TQFP with exposed pad (14x14x1.0 mm) Package29.15—
Note:
  1. Junction to ambient thermal resistance, Theta-JA (θJA) numbers are achieved by package simulations.