55.2 General Operating Ratings and Thermal Conditions

Table 55-2. Operating Frequency versus Voltage (PIC32CX SG41)
Param. No. VDD, AVDD Range Temp. Range (in °C) Max CPU Frequency Comments
DC_5 1.71 to 3.63V -40°C to +85°C 120 MHz Industrial
Note: The same voltage must be applied to VDD and AVDD.
Table 55-3. Operating Frequency versus Voltage (PIC32CX SG60/SG61)
Param. No. VDD, AVDD Range Temp. Range (in °C) Max CPU Frequency Comments
DC_7 2.7 to 3.63V -40°C to +85°C 120 MHz Industrial
Note: The same voltage must be applied to VDD and AVDD.
Table 55-4. Thermal Operating Conditions
Rating Symbol Min. Typ. Max. Unit
Extended Temperature Range:

Operating Ambient Temperature Range

Operating Junction Temperature Range

 TA

TJ

 -40

---

 — 85

105

 °C
Power Dissipation:

Internal Chip Power Dissipation:

PINT = VDD x (IDD –Σ IOHVDD) + AVDD x (IDDANA –Σ IOHAVDD)

I/O Pin Power Dissipation:

PI/O = Σ ((VDD –VOH) x IOHVDD) + Σ (VOL x IOLVDD) + Σ ((AVDD –VOH) x IOHAVDD) + Σ (VOL x IOLAVDD)

 PD PINT + PI/O W
Maximum Allowed Power Dissipation PDMAX (TJ – TA)/θJA W
Table 55-5. Thermal Packaging Characteristics (PIC32CX SG41) (1)
Characteristics Symbol Typ. Max. Unit
Thermal Resistance, 64-pin TQFP (10x10x1.0 mm) Package θJA 57.4 — °C/W
Thermal Resistance, 100-pin TQFP (14x14x1.0 mm) Package 41.11 —
Thermal Resistance, 128-pin TQFP (14x14x1.0 mm) Package 34.45 —
Note:
  1. Junction to ambient thermal resistance, Theta-JA (θJA) numbers are achieved by package simulations.
Table 55-6. Thermal Packaging Characteristics (PIC32CX SG60/SG61) (1)
Characteristics Symbol Typ. Max. Unit
Thermal Resistance, 100-pin TQFP with exposed pad (14x14x1.0 mm) Package θJA 32.67 — °C/W
Thermal Resistance, 100-pin TFBGA (9x9x1.2 mm) Package 25.76 —
Thermal Resistance, 128-pin TQFP with exposed pad (14x14x1.0 mm) Package 29.15 —
Note:
  1. Junction to ambient thermal resistance, Theta-JA (θJA) numbers are achieved by package simulations.