57.1 Absolute Maximum Specifications

Absolute maximum ratings are listed as follows. Exposure to these maximum rating conditions for extended periods may affect device reliability. Functional operation of the device at these, or any other conditions above the parameters indicated in the operation listings of this specification, is not implied.

Table 57-1. MCU Absolute Maximum Electrical Specifications
Ambient temperature under bias-40°C to + 85°C
Storage temperature -60°C to +150°C
Voltage on VDDIO,VDDUTMII, VDDPLLUSB, VDDIN with respect to GND -0.3V to +4.0V
Voltage on VDDCORE,VDDUTMIC,VDDPLL, with respect to GND -0.3V to +1.4V
Voltage on any Input pin(s), with respect to GND -0.3V to (VDDIO+0.3V)
Voltage on D+ or D- pin with respect to GND -0.3V to (VDDIO+0.3V)
Voltage on VREFx with respect to VDDINVDDIN+0.3V
Maximum current out of GND pins 175 mA
Maximum current into VDDIO pins (2)175 mA
Maximum output current sourced/sunk by any Low-Current Mode I/O pin2 mA
Maximum output current sourced/sunk by any High-Current Mode I/O pin4 mA
Maximum current sink by all ports 150 mA
Maximum current sourced by all ports (2)150 mA
Maximum Junction Temperature+125°C
ESD qualification:
Human Body Model (HBM) per JESD22-A1142000 V
Charged Device Model (CDM) (ANSI/ESD STM 5.3.1)…(All pins/Corner pins)500V / 750V
Note:
  1. Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those, or any other conditions above those indicated in the operation listings of this specification, is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
  2. Maximum allowable current is a function of device maximum power dissipation. Worst case Rja in typ conditions is TQFP144.