48.2 Revision G - April 2021
This revision includes the updates as listed in the following table, and numerous typographical corrections throughout the document.
Section | Description |
---|---|
General | The SPI, I2S, and I2C standards use the
terminology "Master" and "Slave". The equivalent Microchip terminology
used in this document is "Host" and "Client" respectively. These terms have been updated throughout this document for this revision. |
Features | Updated RWW to RWWEE for Memories |
Ordering Information | Updated RWW to RWWEE in the Device Variant description |
Pinout | Updated the following Pinouts to accurately display the RESET pin |
I/O Multiplexing |
|
Product Mapping | Updated RWW to RWWEE in the figure |
Memories |
|
Processor and Architecture |
|
DSU |
|
Clock System | Updated Read Request with new verbiage for the READREQ.RCONT and READREQ.RREQ bits |
GCLK | Updated the GENDIV Register with a new Register property, and added a new column for the Maximum Division Factor to the table for the DIV bit. |
SYSCTRL | |
RTC | Updated the Overview with new verbiage for clock sources selectable through the GCLK. |
DMAC | |
EIC | Updated the EXTINTx bit of the INTENCLR register to read “disables the external interrupt.” |
NVMCTRL |
|
EVSYS | |
SERCOM I2C |
|
I2S | Added new slotsize information to PDM Reception. |
TC | Updated the RCONT bit of the READREQ Register with new verbiage for clearing and reading the RREQ and RCONT bits. |
USB | Updated the SPEED Bitfield of the STATUS Register with the proper allocation of low-speed and full-speed mode. |
ADC |
|
DAC | Updated the CTRLB Register with a new note for the REFSEL bitfield. |
Electrical Characteristics at 85°C |
|
Electrical Characteristics at 105°C |
|
Electrical Specifications at 125°C |
|
AEC-Q100 125°C Specifications |
|
SAM DA1 Electrical Characteristics |
|
Appendix B | Added a new Appendix for ISELED Specifications. |
Packaging | The following packages were updated with new drawings: |