49.34 Bluetooth Low Energy RF Characteristics

Table 49-43. Bluetooth Low Energy RF Characteristics
DC CharacteristicsStandard Operating Conditions: VDD33 = VDDIO = AVDD = 1.9–3.6V (Unless Otherwise Stated)

Operating Temperature:

-40°C ≤ TA ≤ +125°C for Extended Temperature

Parameter NumberSymbolCharacteristicsMin.TypMax.UnitsConditions
BTG1FREQFrequency Range of operation2402—2480MHz —
BTTX1TXPWR:PABluetooth Transmit Power PA—11—dBm —
BTX2TXIB:1MBPSIn-band emission for FTX±2 MHz—-42—dBm —
In-band emission for FTX±(3+N) MHz—-48—dBm —
BTX3TXIB:2MBPSIn-band emission for FTX±4 MHz—-49—dBm —
In-band emission for FTX±5 MHz—-52—dBm —
In-band emission for FTX±(6+N) MHz—-55—dBm —
BTRX1RXSENSEReceiver Sensitvity at 1 Mbps—-99—dBm —
Receiver Sensitvity at 2 Mbps—-96—dBm —
Receiver Sensitvity at S = 8—-108.5—dBm —
Receiver Sensitvity at S = 2—-103—dBm
BTRX2MAXINSIGMaximum Input signal level at 1 Mbps—0—dBm —
Maximum Input signal level at 2 Mbps—0—dBm —
Maximum Input signal level at S = 2—0—dBm —
Maximum Input signal level at S = 8—0—dBm —
BTRX3CI1M:COCHC/I Co channel Rejection—13—dB —
CI1M:±1 MHzC/I Adjacent Channel Rejection—15—dB —
CI1M:±2 MHzC/I Adjacent Channel Rejection—7—dB —
CI1M:ADJ(3+n)C/I Alternate Channel Rejection—6—dB —
CI1M:IMGC/I Image Frequency Rejection—11—dB —
CI1M:IMG±1 MHzC/I Adjacent Channel to Image Freq Rejection—12—dB —
BTRX4CIS2:COCHC/I Co channel Rejection—11—dB —
CIS2:±1 MHzC/I Adjacent Channel Rejection—19—dB —
CIS2:±2 MHzC/I Adjacent Channel Rejection—18—dB —
CIS2:ADJ(3+n)C/I Alternate Channel Rejection—7—dB —
CIS2:IMGC/I Image Frequency Rejection—18—dB —
CIS2:IMG±1 MHzC/I Adjacent Channel to Image Freq Rejection—13—dB —
BTRX5CIS8:COCHC/I Co channel Rejection—3—dB —
CIS8:±1 MHzC/I Adjacent Channel Rejection—20—dB —
CIS8:±2 MHzC/I Adjacent Channel Rejection—14—dB —
CIS8:ADJ(3+n)C/I Alternate Channel Rejection—3—dB —
CIS8:IMGC/I Image Frequency Rejection—14—dB —
CIS2:IMG±1 MHzC/I Adjacent Channel to Image Freq Rejection—15—dB —
BTRX6CI2M:COCHC/I Co channel Rejection—12—dB —
CI2M:±2 MHzC/I Adjacent Channel Rejection—14—dB —
CI2M:±4 MHzC/I Adjacent Channel Rejection—12—dB —
CI2M:ADJ(6+2n)C/I Alternate Channel Rejection—14—dB—
CI2M:IMGC/I Image Frequency Rejection—13—dB —
CI2M:IMG±2 MHzC/I Adjacent Channel to Image Freq Rejection—14—dB —
BTRX7BLOCK1M:<2 GHZBlocking performance from 30 MHz to 2 GHz—20—dB —
BLOCK1M:2 GHZ<SIG<2399 MHzBlocking performance from 2003–2399 MHz—20—dB —
BLOCK1M:2484 MHZ<SIG<2977 MHzBlocking performance between 2484–2997 MHz—20—dB —
BLOCK1M:3 GHZ<SIG<12.75 GHzBlocking Performance between 3.0–12.5 GHz—20—dB —
BTRX8BLE1M:INTERMODInter modulation performance for BLEM—8.5—dB —
BLE2M:INTERMODInter modulation performance for BLEM—9.5—dB —
Note:
  1. These parameters are characterized, but not tested in manufacturing.
Table 49-44. Bluetooth Low Energy RF Current Consumption
DC CharacteristicsStandard Operating Conditions: VDD33 = VDDIO = AVDD = 1.9–3.6V (Unless Otherwise Stated)

Operating Temperature:

-40°C ≤ TA ≤ +125°C for Extended Temperature

Parameter NumberSymbolCharacteristicsRF PowerCPU FrequencyMin.Typ.Max.UnitsConditions
IBLETX_1IDDTXPA1MCurrent Consumption with TX in MLDO mode at 1 Mbps+11 dBm128 MHz—52.9—mAVDD = 3.3V; Temperature = 25°C CPU Consumption included
+11 dBm64 MHz—46.0—mA
+11 dBm32 MHz—42.5—mA
0 dBm128 MHz—28.3—mA
0 dBm64 MHz—21.4—mA
0 dBm32 MHz—18.0—mA
IBLETX_3IDDTXPA1BCurrent Consumption with TX in Buck mode at 1 Mbps+11 dBm128 MHz—26.3—mA
+11 dBm64 MHz—22.9—mA
+11 dBm32 MHz—21.3—mA
0 dBm128 MHz—15.0—mA
0 dBm64 MHz—11.7—mA
0 dBm32 MHz—10.1—mA
IBLERX_1IDDRXBLE1MCurrent consumption at Rx signal MLDO mode at 1 Mbps-80 dBm128 MHz—22.7—mA
-80 dBm64 MHz—15.8—mA
-80 dBm32 MHz—12.3—mA
IBLERX_3IDDRXBLE1BCurrent consumption at Rx signal BUCK mode at 1 Mbps-80 dBm128 MHz—12.5—mA
-80 dBm64 MHz—9.2—mA
-80 dBm32 MHz—7.6 —mA
Figure 49-35. Bluetooth Low Energy Transmit Power vs. Temperature
Note:
  • Bluetooth Low Energy transmit power is measured across temperature after transmit power calibration at 3.6V and 2440 MHz.
  • Temperature power compensation is triggered before power measurement.
  • Transmit power is measured after the PA matching and LPF.
Figure 49-36. Bluetooth Low Energy Transmit Power vs. VDD Supply Voltage
Note:
  • Bluetooth Low Energy transmit power is measured across voltage after transmit power calibration.
  • Transmit power is measured after calibration at +11 dBm (± 0.5 dBm).
  • Transmit power is measured on board based on the Microchip Reference Design.
  • Transmit power is measured after the PA matching and LPF.
Figure 49-37. Bluetooth Low Energy Transmit Power vs. Frequency
Note:
  • Bluetooth Low Energy transmit power is measured across frequency after transmit power calibration at 3.3V (Buck mode).
  • Transmit power is measured after the PA matching and LPF.
Figure 49-38. Bluetooth Low Energy Transmit Power vs. Power Level
Note:
  • Bluetooth Low Energy transmit power is measured at 2440 MHz after transmit power calibration.
  • Transmit power is measured on board based on Microchip Technology Reference Design.
  • Transmit power is measured after the PA match and LPF.
Figure 49-39. Bluetooth Low Energy Transmit Current vs. Temperature
Note:
  • Bluetooth Low Energy transmit current is measured at 3.3V (Buck mode) at 2440 MHz across temperature.
  • Transmit current is measured after calibration at +11 dBm (± 0.5 dBm).
  • Current is measured on input power rail to SoC.
Figure 49-40. Bluetooth Low Energy Receive Sensitivity vs. Voltage
Note:
  • Bluetooth Low Energy 1M C/I Margin is measured at 2440 MHz at 25℃, uncoded data at 1 Ms/s.
  • PDU length = 37.
  • Sensitivity is measured according to the SIG specifications.
Figure 49-41. Bluetooth Low Energy Receive Sensitivity vs. Frequency
Note:
  • Bluetooth Low Energy receiver sensitivity is measured across channels at 3.6V at 25℃, uncoded data at 1 Ms/s.
  • PDU length = 37.
  • Sensitivity is measured according to the SIG specifications.
Figure 49-42. Bluetooth Low Energy Receive Current vs. Temperature
Note:
  • Bluetooth Low Energy receive current is measured at 3.3V (Buck mode), uncoded data at 1 Ms/s with LNA configured at maximum gain.
  • PDU length = 37.
  • Current is measured on input power rail to SoC (includes processor current as well).
Figure 49-43. Bluetooth Low Energy Rx CI Margin
Note:
  • Bluetooth Low Energy 1M C/I Margin is measured at 25℃, 3.6V, uncoded data at 1 Ms/s.
  • Reported C/I margin is the margin above the C/I specifications from SIG.
Figure 49-44. Module Bluetooth Low Energy Receive Current vs. Temperature
Note:
  • Bluetooth Low Energy receive current is measured at 3.3V (Buck mode), uncoded data at 1 Ms/s with LNA configured at maximum gain.
  • PDU length = 37.
  • Current is measured on input power rail to SoC (includes processor current as well).
Figure 49-45. Module Bluetooth Low Energy Receive Sensitivity vs. Temperature
Note:
  • Bluetooth Low Energy receive sensitivity is measured across temperature at 3.6V, 2440 MHz, uncoded data at 1 Ms/s.
  • PDU length = 37.
  • Sensitivity is measured according to the SIG specifications.
Figure 49-46. Module Bluetooth Low Energy Receive Sensitivity vs. Frequency
Note:
  • Bluetooth Low Energy receive sensitivity is measured across temperature at 3.6V at 25℃, uncoded data at 1 Ms/s.
  • PDU length = 37.
  • Sensitivity is measured according to the SIG specifications.